Vertical edge detection-based automatic optical inspection for solder jet ball joint defect on Head Gimbal Assembly

Ieamsaard, Jirarat; Yammen, Suchart; Muneesawang, Paisarn

doi:10.1109/ecticon.2015.7206989

Cited by 2 publications

(1 citation statement)

References 16 publications

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“…Among them, the spherical ball grid array (BGA) solder joint stands out for the following reasons: numerous I/O points, no pin distortion, low self-inductance and mutual inductance, and favorable frequency and coplanarity. Thanks to these advantages, the spherical BGA solder joints, integrated with the popular surface-mount technology (SMT), has been extensively adopted as a new form of chip package [1][2][3][4]. Against this backdrop, it is very important to ensure the quality of BGA solder joints.…”

Section: Introductionmentioning

confidence: 99%

Detection of ball grid array solder joints based on adaptive template matching

Hao¹,

Li²,

Sun³

et al. 2018

IJHT

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This paper aims to achieve the accurate detection of ball grid array (BGA) solder joints. To this end, the author presented an adaptive template matching method for BGA solder joints based on shape detection. First, the region of interest (ROI) was selected from the X-ray image of the printed circuit board (PCB). Then, an edge template was generated through ROI extraction and threshold segmentation, and the direction vector f the edge template was taken as the prior knowledge. After that, the global traversal search was performed on the image pyramid in the top-down manner, aiming to obtain the potential matching targets. Finally, the edges were adjusted by the least squares method to yield the optimal matching results. The proposed method was proved robust, rapid and accurate through an experiment. The research findings shed new light on the BGA solder joint detection and extraction in various conditions.

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Section: Introductionmentioning

confidence: 99%