Venting temperature determines surface chemistry of magnetron sputtered TiN films

Greczyński, Grzegorz; Mráz, Stanislav; Hultman, Lars; Schneider, Jochen M.

doi:10.1063/1.4940974

Cited by 109 publications

(44 citation statements)

References 32 publications

(32 reference statements)

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“…The deposition time on amorphous carbon substrates was 5 min and on sapphire 30 min, where the first samples were used to enable optimum Rutherford back-scattering spectrometry (RBS) measurements conditions while the second set was used for nanoindentation, thermal stability and atom probe investigations. In order to avoid surface oxidation [43], all samples were cooled in vacuum and taken out of the deposition system only when the temperature was below 50°C.…”

Section: Methodsmentioning

confidence: 99%

Unprecedented thermal stability of inherently metastable titanium aluminum nitride by point defect engineering

Baben

Hans

Primetzhofer

et al. 2016

Materials Research Letters

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Extreme cooling rates during physical vapor deposition (PVD) allow growth of metastable phases. However, we propose that reactive PVD processes can be described by a gas-solid paraequilibrium defining chemical composition and thus point defect concentration. We show that this notion allows for point defect engineering by controlling deposition conditions. As example we demonstrate that thermal stability of metastable (Ti,Al)N x , the industrial benchmark coating for wear protection, can be increased from 800°C to unprecedented 1200°C by minimizing the vacancy concentration. The thermodynamic approach formulated here opens a pathway for thermal stability engineering by point defects in reactively deposited thin films. IMPACT STATEMENTA novel thermodynamic methodology to predict stoichiometry of coatings is utilized to increase thermal stability of today's industrial benchmark hard coating TiAlN from 800°C to 1200°C by point defect engineering. ARTICLE HISTORY

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Section: Methodsmentioning

confidence: 99%

Unprecedented thermal stability of inherently metastable titanium aluminum nitride by point defect engineering

Baben

Hans

Primetzhofer

et al. 2016

Materials Research Letters

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“…The vacuum chamber is vented at the substrate temperature lower than 180 °C to allow for a better control of surface chemistry upon air exposure. 27 Four different powering schemes are employed to deposit four series of V1-xAlxN films with varying Al/(Al+V) ratio x, with distinctly different ion irradiation conditions during growth. Two first series are obtained using a hybrid process in which one of the targets is operated in HIPIMS mode, while the other runs as a conventional magnetron (Al-HIPIMS/V-DC and V-HIPIMS/Al-DC).…”

Section: Film Growthmentioning

confidence: 99%

Extended metastable Al solubility in cubic VAlN by metal-ion bombardment during pulsed magnetron sputtering: film stress vs subplantation

Greczyński

Mráz

Rueß

et al. 2017

Journal of Applied Physics

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The self-archived version of this journal article is available at Linköping University Electronic Press: http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-139557 N.B.: When citing this work, cite the original publication.Greczynski, G., Mraz, S., Ruess, H., Hans, M., Lu, J., Hultman, L., Schneider, J. M., (2017) AbstractDynamic ion-recoil mixing of near-film-surface atomic layers is commonly used to increase the metastable solubility limit xmax in otherwise immiscible thin film systems during physical vapor deposition. Recently, Al subplantation achieved by irradiating film growth surface with Al + metalion flux was shown to result in an unprecedented xmax for VAlN, far above values obtained with gas ion irradiation. However, it is reasonable to assume that ion irradiation necessary for subplantation also leads to a compressive stress σ buildup. In order to separate the effects of Al + bombardment on σ and xmax, and realize low-stress high-xmax nitride alloys, we grow metastable

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“…It can be concluded that the venting temperature is an important and influential parameter for the surface chemistry of carbide nanocomposites. An analogous effect has also been demonstrated for TiN [40]. Conversely, it may possible to reduce these oxides by vacuum annealing, as has been done for air-exposed Ni 3 C/a-C coatings [41].…”

Section: Surface Characterization Of Coatingsmentioning

confidence: 78%

Passive films on nanocomposite carbide coatings for electrical contact applications

et al. 2017

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Nanocomposite transition metal carbide/amorphous carbon coatings (Me-C/a-C) deposited by magnetron sputtering have excellent electrical contact properties. The contact resistance can be as low as that of noble metal coatings, although it is known to vary by several orders of magnitude depending on the deposition conditions. We have investigated a nanocrystalline niobium carbide/ amorphous carbon (NbC x /a-C:H) model system aiming to clarify factors affecting the contact resistance for this group of contact materials. For the first time, the surface chemistry is systematically studied, by angle-resolved X-ray photoelectron spectroscopy, and in extension how it can explain the contact resistance. The coatings presented a mean oxide thickness of about 1 nm, which could be grown to 8 nm by annealing. Remarkably, the contact resistances covered four orders of magnitude and were found to be exponentially dependent on the mean oxide thickness. Moreover, there is an optimum in the amount of a-C:H phase where the contact resistance drops very significantly and it is thus important to not only consider the mean oxide thickness. To explain the results, a model relying on surface chemistry and contact mechanics is presented. The lowest contact resistance of a nanocomposite matched that of a gold coating at 1 N load (vs. gold), and such performance has previously not been demonstrated for similar nanocomposite materials, highlighting their useful properties for electrical contact applications.

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Venting temperature determines surface chemistry of magnetron sputtered TiN films

Cited by 109 publications

References 32 publications

Unprecedented thermal stability of inherently metastable titanium aluminum nitride by point defect engineering

Unprecedented thermal stability of inherently metastable titanium aluminum nitride by point defect engineering

Extended metastable Al solubility in cubic VAlN by metal-ion bombardment during pulsed magnetron sputtering: film stress vs subplantation

Passive films on nanocomposite carbide coatings for electrical contact applications

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