VCSEL array module using (111) facet mirrors of a V-grooved silicon optical bench and angled fibers

Hwang, Sung Hwan; An, Jae Yong; Kim, Myeong-Hyun; Choi, Woo Chang; Cho, Sung Ryul; Lee, Sang-Hwan; Cho, Han Seo; Park, Hyo‐Hoon

doi:10.1109/lpt.2004.840275

Cited by 16 publications

(1 citation statement)

References 6 publications

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“…as well as waveguide-type devices, vertical optical path conversion devices are needed in order to achieve hybrid photonic integration using a combination of optical waveguide devices and array-type devices. 1,6) The literature introduces a number of vertical optical path conversion devices, a 45 mirror formed by a dicing saw, 3) a special method of flowing liquid resin into a hook shaped etched groove, 4) and an optical surface mount technology 2) utilizing optical printed circuit boards, 1) among others.…”

Section: Introductionmentioning

confidence: 99%

Low Loss Vertical Optical Path Conversion Using 45° Mirror for Coupling between Optical Waveguide Devices and Planar Devices

Johraku¹,

Kimura²

2008

jjap

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To realize low loss optical interconnects between optical waveguide devices and two dimensional array-type devices, we investigated a novel 45 mirror device buried by index matching epoxy resin and coated with an anti-reflection layer. A groove with an isosceles right triangle cross section was formed using a dicing saw so as to cut into the single-mode optical waveguide, and aluminum thin film was obliquely deposited on the 45 side wall of the groove to increase the reflectance. The groove was filled with a spin-coating of UV-curable epoxy resin to planarize the top surface, and low index polymer (Teflon) was formed on the top surface as the anti-reflection layer. The optimum depth of the groove for reducing shadowing of the deflected beam was analyzed. As a result the insertion loss of the 45 mirror was reduced 1.3 dB compared to the insertion loss of straight waveguide. In addition, a novel optical tap device is proposed and demonstrated using a similar fabrication process to that of the 45 mirror device. The isosceles right triangle-shaped groove was formed on the upper cladding layer so as to almost touch the core layer. After filling it in and finishing it with the epoxy resin and AR coating used in the 45 mirror device, the loss of the through port was reduced 0.5 dB compared to the insertion loss of straight waveguide and À14 dB (4.0%) of the optical power was transmitted to the tap port. Lastly as a model of the coupling between waveguide devices and two-dimensional arrayed devices such as vertical cavity surface emitting lasers (VCSEL's), the vertical port of the 45 mirror device was connected to a single mode fiber with a very small mode field diameter (3.6 mm). This configuration transmitted À11:8 dB (6.6%) of the input power from the input port to the vertical tap port and vice versa.

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Section: Introductionmentioning

confidence: 99%

Low Loss Vertical Optical Path Conversion Using 45° Mirror for Coupling between Optical Waveguide Devices and Planar Devices

Johraku¹,

Kimura²

2008

jjap

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Low-cost high-efficiency optical coupling using through-silicon-hole in parallel optical transceiver module

Wan

et al. 2009

Appl. Phys. A

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Efficacy of low etch rate in achieving nanometer-scale smoothness of Si (100) and (110) plane surfaces using KOH and KOH/IPA solutions for optical mold applications

Lee

Park

et al. 2014

Sensors and Actuators A: Physical

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VCSEL array module using (111) facet mirrors of a V-grooved silicon optical bench and angled fibers

Cited by 16 publications

References 6 publications

Low Loss Vertical Optical Path Conversion Using 45° Mirror for Coupling between Optical Waveguide Devices and Planar Devices

Low Loss Vertical Optical Path Conversion Using 45° Mirror for Coupling between Optical Waveguide Devices and Planar Devices

Low-cost high-efficiency optical coupling using through-silicon-hole in parallel optical transceiver module

Efficacy of low etch rate in achieving nanometer-scale smoothness of Si (100) and (110) plane surfaces using KOH and KOH/IPA solutions for optical mold applications

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