Vapour phase soldering used for quality improvement of semiconductor thermogenerators (TEGs) assembly

Synkiewicz, Beata; Skwarek, Agata; Witek, Krzysztof

doi:10.1016/j.mssp.2014.12.004

Cited by 30 publications

(15 citation statements)

References 11 publications

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“…Setting of this profile [12] or optimizations with statistical methods [13] were also investigated. Power electronics manufacturers utilize VPS due to the efficient soldering of large components [14][15][16][17]. Research of the energy efficiency is also under active investigations [18].…”

Section: Fig 1 Scheme Diagram Of Vps Ovenmentioning

confidence: 99%

Alternative Inspection Methods of Vapour Phase Soldering Work Zone

Géczy¹,

Alaya²,

Hantos

et al. 2018

2018 41st International Spring Seminar on Electronics Technology (ISSE)

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Vapour Phase Soldering (VPS) is a reflow soldering method used for special assemblies, where even heat distribution, uniform and high soldering quality is critical. To aim for the best joint quality, it is important to investigate the process and the state of the work zone. While VPS is a much more complex process than regular reflow methods, our paper aims to approach the monitoring of the work zone by novel and alternative paths, which can ultimately lead to a better control on the ovens, aiming for compliance with the zero defect manufacturing, and Industry 4.0 directives. For our work, two paths were defined. With the use of an infracamera, the possibility of quantitative optical observation was investigated, also the equalized temperatures of the measured board can be verified. With pressure sensing, the state of the vapour blanket can be investigated, which can lead ultimately to more reliable working cycles. The latter method shows promising results pointing to more refined process control; the former method shows limitations in the application within the field of VPS.

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Section: Fig 1 Scheme Diagram Of Vps Ovenmentioning

confidence: 99%

Alternative Inspection Methods of Vapour Phase Soldering Work Zone

Géczy¹,

Alaya²,

Hantos

et al. 2018

2018 41st International Spring Seminar on Electronics Technology (ISSE)

View full text Add to dashboard Cite

show abstract

“…The method was investigated for LED and BGA based assemblies [16]. The quality of the joints was also a crucial question in comparison of other reflow methods [17], in the specific field of power electronics [18], airborne electronics [19], or regular surface mounting, with the focus on void failure analysis [20,21].…”

Section: Introductionmentioning

confidence: 99%

Validation of Heat-Level Vapor Phase Soldering Process and Workspace Leakage Detection with Applied Pressure Sensors

et al. 2021

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Electronic manufacturing principles are continuously developing, further improving assembly quality and productivity. There is a continuous need to apply novel and improved methods of process monitoring to provide accurate measurement and control during assembling. In this paper, a new principle for monitoring filmwise condensation-based heat-level—vapour phase soldering (HL-VPS) is presented to improve the process control. The experiment is based on thermocouple sensors in fusion with a sensitive gauge type pressure sensor. The aim is to precisely identify the steps of condensation-based reflow heat transfer process with commercially available components and the mindset of possible retrofitting in the generally used HL-VPS soldering ovens. It was found that the gauge sensor can follow the state of the workspace more precisely as the thermocouples, by monitoring the hydrostatic state of the vapour. The pressure (time) function gives information about the build-up of the vapour column, highlighting four characteristic steps (phases) of the process, meaning: immersion of the sample to be soldered, condensation-based heat transfer, solder-break, and cooling. Combined application with thermocouples enables more precise control, improving soldering quality and can reduce idle time of the oven. In addition, it was showed that the gauge type sensors could highlight any failure in the oven sealing by a sensor signal threshold detection. The original concept of workspace identification also fits the present and future industry 4.0 directives.

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“…Real time temperature profiling [9] or optimizations with statistical methods [10] were also investigated by Livovsky and Tsai, respectively. Power electronics manufacturers utilize VPS due to the efficient soldering of large components [11][12][13][14][15][16]. Research of the energy efficiency is also under active investigations [17].…”

Section: Introductionmentioning

confidence: 99%

Component level modelling of heat transfer during vapour phase soldering with finite difference ADI approach

Bozsóki

Géczy

Illés

2019

International Journal of Heat and Mass Transfer

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In this paper the complex heat transfer process of the vapour phase soldering has been investigated on the level of electronic components. VPS is gaining increased attention lately, and the process needs different approach of modelling, compared to conventional soldering processes in electronics mass manufacturing. Component level modelling was not studied deeply in the literature before, so our focus pointed to heat transfer on large size surface mounted electronic components. Applying the Fourier type heat conduction equation, a detailed 3D thermal model of a polyester capacitor on a printed circuit board was implemented based on x-ray images of an actual assembly. Our model incorporates inner geometry, material inhomogeneity, composite materials and anisotropic thermal conductivity as important thermal features. Transient heating was calculated with Finite Difference Method combining an alternating direction implicit (ADI) approach, using averaged heat transfer coefficient. Validation measurements were taken in our VPS system. The measured data show good agreement with the calculation results and points to possible application for use in advanced engineering environment.

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Vapour phase soldering used for quality improvement of semiconductor thermogenerators (TEGs) assembly

Cited by 30 publications

References 11 publications

Alternative Inspection Methods of Vapour Phase Soldering Work Zone

Alternative Inspection Methods of Vapour Phase Soldering Work Zone

Validation of Heat-Level Vapor Phase Soldering Process and Workspace Leakage Detection with Applied Pressure Sensors

Component level modelling of heat transfer during vapour phase soldering with finite difference ADI approach

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