Validation of models for air cooled plane fin heat sinks used in computer cooling

Saini, Manohar Singh; Webb, Ralph L.

doi:10.1109/itherm.2002.1012464

Cited by 21 publications

(20 citation statements)

References 9 publications

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“…These models assume a uniform airflow at the heat sink inlet. The validity of these models was determined by experiments reported by Saini and Webb [9]. The applicability of the models for predicting performance of fan mounted heat sinks, where the flow is quite different from uniform flow as assumed in the heat sink models [9], [10], is discussed later in this manuscript.…”

Section: )mentioning

confidence: 98%

“…The validity of these models was determined by experiments reported by Saini and Webb [9]. The applicability of the models for predicting performance of fan mounted heat sinks, where the flow is quite different from uniform flow as assumed in the heat sink models [9], [10], is discussed later in this manuscript. Neglecting , total thermal resistance, , is given by (1) Of the four resistances in (1), , and are constants for a given base area ( ), so (the airside convection resistance) should be minimized in order to minimize .…”

Section: )mentioning

confidence: 98%

“…For a given fin geometry and flow configuration, one needs a mathematical model for pressure drop and heat transfer of the heat sink. The chosen heat sink model for duct flow is by Saini and Webb [9] and for impinging flow is by Biber [10], modified by Saini and Webb [9]. These models assume a uniform airflow at the heat sink inlet.…”

Section: )mentioning

confidence: 99%

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Heat rejection limits of air cooled plane fin heat sinks for computer cooling

Saini

Webb

2003

IEEE Trans. Comp. Packag. Technol.

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Current desktop computers typically use fan-heat sinks for cooling the CPU, referred to as active heat sinks. This work seeks to determine the heat rejection limits for such fan-heat sinks, within specific fan and heat sink space limits. A fixed volume, 80 60 50 mm is chosen as the limiting dimensions, which includes the fan volume. The present work addresses plane fin heat sinks, on which a typical 60 mm fan is mounted. Both duct flow and impinging flow are considered. Analytically based models are used to predict the optimum geometry (minimum convection resistance) for plane fins with duct and impinging flow configurations. Also assessed are the effects of increased fan speed (up to 25%) and heat sink base size (33% increase) on air-cooling limits in duct and impinging flow. Tests on fan-heat sinks are done to validate the predictions. Optimization is also done for an enhanced (offset-strip) fin geometry in duct flow. The plane fin is found to outperform the enhanced geometry.

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Section: )mentioning

confidence: 98%

Section: )mentioning

confidence: 98%

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Heat rejection limits of air cooled plane fin heat sinks for computer cooling

Saini

Webb

2003

IEEE Trans. Comp. Packag. Technol.

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“…It is important to validate the predictive models using data. For example, Saini and Webb [1] performed experiments to validate their modeling of duct flow in plain-fin heat sinks.…”

Section: Introductionmentioning

confidence: 99%

Entrance and Exit Losses for Developing Flow in Parallel Plate Channels

Webb¹

2006

Heat Transfer Engineering

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An analysis is presented to calculate the entrance and exit losses for developing flow in parallel plate channels. Such an analysis is of value for air-cooled heat sinks with short flow length, such as electronic heat sinks. These predictions are typically done using inlet (K c ) and exit (K e ) loss coefficients for parallel plate channels from the Kays and London book, Compact Heat Exchangers. However, the information presented in Compact Heat Exchangers assumes fully developed flow at the exit. Electronic heat sinks operate in the developing flow region. Thus, the use of the published K c and K e from Compact Heat Exchangers will result in an overestimation of the actual K c and K e values. The present author has completed an analysis that allows the accurate calculation of K c and K e values with parallel plate channels in the developing flow region. The results are presented in graphical and equation form as a function of contraction ratio and 4x + (= 4x/D h Re). Entrance and exit losses can account for as much as 30% of the total pressure drop in electronic heat sinks having short flow lengths. Fortunately, the error associated with evaluation of K c and K e based on fully developed flow for parallel plates is small and expected to be less than 2%.

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“…The thermal perforounce of the liquid cooled heat sinks can be compared with the air cooled heat sinks. Among the efforts to enhance the air cooling, a minimized thermal resistance of 0.304 "C/W at a heat source size 16 mm x 16 mm [14] was achieved. By using the liquid cooled techniques, the thermal resistances of heat sinks can be reduced hy 50% as per our present modeling studies.…”

Section: Effect Of the Heat Sink Thermal Conductivitymentioning

confidence: 99%

Thermal modeling and design of liquid cooled heat sinks assembled vvith flip chip ball grid array packages

Zhang¹,

Pinjala²,

Joshi³

et al.

53rd Electronic Components and Technology Conference, 2003. Proceedings.

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Development of advanced cooling techniques is required for electronic packages with high power dissipation such as microprocessors. In this paper, a liquid cooling setup is proposed and the thermal modeling and design of a liquid cooled microchannel heat sink assembled with a flip chip ball grid array (FCBGA) package are addressed, with an emphasis on the removal of a heat flux beyond 100W/cm2. A full model, which includes the microchannel heat sink with inletloutlet manifolds, the package and thermal test hoard, is developed. To reduce the overall modeling efforts, a compact package model is used. Two different flow pattems, the liquid flow through the microchannel heat sink populated with microchannellfms and the natural convection of air surrounding the package, are modeled simultaneously. The full model is compared with the heat sink model without the package assembly. Parametric studies are conducted on the effects of the channel width, the heat sink base thickness and the heat sink material. In line with the modeling analysis, a microchannel heat sink with a f m e d array compatible with the FCBGA package was developed. The measurements show that the current liquid cooling setup can achieve 'a power dissipation of 130 W/cm2. The comparison with simulation shows agreement within 11% in pressure drop and 5% in thermal resistance.

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Validation of models for air cooled plane fin heat sinks used in computer cooling

Cited by 21 publications

References 9 publications

Heat rejection limits of air cooled plane fin heat sinks for computer cooling

Heat rejection limits of air cooled plane fin heat sinks for computer cooling

Entrance and Exit Losses for Developing Flow in Parallel Plate Channels

Thermal modeling and design of liquid cooled heat sinks assembled vvith flip chip ball grid array packages

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