Validation and application of different experimental techniques to measure electronic component operating junction temperature

Determination of self-heating and thermal resistance in polycrystalline and bulk silicon resistors by DC measurements

“…For these methods no additional equipment is needed. Commonly, diodes either in forward or reverse direction usually act as integrated temperature sensors [3][4][5]. This requires dedicated test structures, which leads to more design effort and increasing costs.…”

Applications of infrared thermography in electronics research

“…In the example depicted in Fig. 5, steady state thermal performance of an isolated SO-8 package is experimentally characterised on five thermal test PWBs [6]. The study includes three FR4 and two insulated metal substrate (IMS) standard test PWBs, each displaying a different internal structure and effective thermal conductivity.…”

Effect of both PCB thermal conductivity and nature of forced convection environment on component operating temperature: Experimental measurement and numerical prediction

“…The SO-8 test component contained a G423, 0.63 x 0.63mm thermal test die from Infineon [22], and the SBGA352 package from Amkor contained a 10.16mm square, PST6 test die. Each die had the functionality that allowed it dissipate power, while simultaneously allowing the operating junction temperature to be measured by monitoring the forward biased voltage across a centrally mounted diode [23]. The temperature sensitive diode of each test die was calibrated in accordance with JEDEC standard EIA/JESD 51-1 [24] to an accuracy of ±0.5°C, and the power dissipation level (Q) could be controlled to ±0.1%.…”