“…570 For strictly BEOL applications, photo-assisted depositions of both metals and low- dielectrics have been explored over the past two decades. Specifically, photo-assisted CVD 497,571 and ALD 572,573 of important interconnect metals such as Al, 574,575 W, 576 and Cu 513 and photo-assisted electroplating (EP) of Cu 577 have been reported. In some cases, selective are photo-CVD processes have also been reported for Al, Cu, and W. 578 However, neither photoassised CVD or EP have yet to supplant the current PVD, CVD, and EP methods utilized to deposit these metals in BEOL interconnect fabrication.…”