Vacuum sealed MEMS package with an optical window

Marinis, Thomas F.; Soucy, Joseph W.; Lawrence, Jay; Marinis, Ryan T.; Pryputniewicz, Ryszard J.

doi:10.1109/ectc.2008.4550067

Cited by 9 publications

(5 citation statements)

References 2 publications

(1 reference statement)

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“…When greater hermeticity is required, especially in cases where the MEMS devices require vacuum seals and high quality windows, some other packages have been designed attaching windows with a gold/titanium/platinum seal ring on a leadless ceramic chip carrier [56]. The glass window thickness is determined by the package size as well as by the allowable diffusion of hydrogen and helium into the package.…”

Section: Micro-mirror Arraymentioning

confidence: 99%

MEMS Packaging Materials

Darrin

Osiander

2011

MEMS Reference Shelf

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This chapter discusses the differences between the heritage microcircuit packaging world and the still evolving MEMS packaging arena. Materials used in the packaging of MEMs are reviewed and their respective applications. The packaging schemes for these devices owe their infrastructure base to the body of knowledge surrounding semiconductors and microcircuits. MEMS devices yield new complexities which drive new packaging solutions. As opposed to traditional microcircuit chips, MEMS often include moving structures along with the need to have contact with the external environment, driving the requirements for packaging such components. Thus, some functions include interaction with the surrounding environment, such as pressure sensors. This imposes new requisites on packaging, since in regular microelectronics the chip must be protected completely from any impact from the environment. Packaging also provides mechanical support to the sensitive chip, facilitating the handling of the chip, and simplifying assembly. This chapter emphasizes the materials involved in packaging MEMS devices and the addresses the challenges involved. Included in this chapter are several case studies demonstrating novel packaging/material solutions. MEMS Packages and ApplicationsPackaging for MEMs provides for power and signal paths; thermal management; mechanical support; and environmental protection and/or interface protection. MEMS pose numerous packaging challenges that often drive custom solutions by the very nature of their configurations and applications. Commercialized MEMS products such as inkjets and airbag sensors use simple packaging solutions; but devices that involve environmental interface have special requirements that drive

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Section: Micro-mirror Arraymentioning

confidence: 99%

MEMS Packaging Materials

Darrin

Osiander

2011

MEMS Reference Shelf

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“…Regarding the vacuum packaging, our substrate-free FPA is unlike other optical or IR MEMS devices [5], [6], [9], [10]. There are two transparent windows with different materials for visible and IR light, respectively, that need to be assembled with a metal chamber.…”

Section: Packaging and Measurementmentioning

confidence: 99%

Investigation on Performance and Vacuum Package of MEMS Infrared Focal Plane Arrays

Ou¹,

Li²,

Qu³

et al. 2013

IEEE Electron Device Lett.

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A substrate-free microelectromechanical system (MEMS) focal plane array (FPA) has been successfully developed. Since there is no silicon substrate beneath the FPA's pixels, the infrared radiation (IR) loss has been significantly reduced. However, at ambient pressure, it is difficult to obtain a clear visible image due to the sensitivity loss caused by the thermal conductance of air. To improve the packaged FPA's performance, its thermal sensitivity and response time were investigated under varying air pressure. The high-contrast IR thermal images of a human hand were captured at room temperature and under an air pressure of 0.01 Pa, and the noise-equivalent temperature difference of the FPA was also estimated to be about 373 mK compared with the 1.4 K under a pressure of 10 Pa. What is important is that the FPA's response time was increased from 50.1 to 336.6 ms by the decrease in air pressure. In addition, we present an approach to package the MEMS FPA at a low-pressure vacuum with two optical windows, which is an effective way to increase FPA's sensitivity.Index Terms-Focal plane array (FPA), microelectromechanical systems (MEMSs), response time, thermal sensitivity, uncooled, vacuum package.

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“…Pumping systems are necessary in many fields, particularly in microdevices/nanodevices. Pumping techniques are used in various applications, such as using mechanical resonators , optical devices , and gas‐controlling devices . Here, we focus on vacuum pumping.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of on‐chip vacuum pump using a silicon nanostructure by metal‐assisted chemical etching

Inomata

Kamakura

Toàn

et al. 2019

IEEJ Transactions Elec Engng

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We proposed, fabricated, and evaluated an on-chip vacuum pumping device using a nanoporous structure fabricated using metalassisted chemical etching (MACE) on silicon (Si). The driving principle relies on thermal transpiration, which is generally referred to as a Knudsen pump. MACE can be used to fabricate high-aspect nanostructures of Si, which is advantageous for obtaining a high performance similar to that of a Knudsen pump because the nanochannels and temperature difference are significant components of this principle. The pumping device consists of wafers arranged as follows: glass (300 μm)/Si (200 μm)/glass (200 μm). The glass wafers have small chambers, and the Si wafer has a nanoporous structure with wide channels. One hundred and thirty-two stages (pairs of cool and hot chambers) are cascaded. Vacuum levels are evaluated using a suspended thin diaphragm of Si. The device is fabricated using conventional microfabrication techniques. In the fabricated device, the temperature of the cool and hot sides is maintained at 70 and 230 • C. The chamber pressure in the 132nd stage was estimated to be 85.9 kPa, and the evacuation speed was approximately 10 min. the area of microelectromechnical systems (MEMSs), nanoelectromechanical systems (NEMSs), silicon-based nanofabrication, ultrasensitive sensing based on resonating device, scanning probe technologies, and nanoprobe sensing for nanoscale science and engineering. Recent interests cover nanomaterials and their integration into the microsystem for applications of IoT sensors, environment monitoring, biomedical sensors, nanoenergy, and scientific instrumentation.

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Vacuum sealed MEMS package with an optical window

Cited by 9 publications

References 2 publications

MEMS Packaging Materials

MEMS Packaging Materials

Investigation on Performance and Vacuum Package of MEMS Infrared Focal Plane Arrays

Fabrication of on‐chip vacuum pump using a silicon nanostructure by metal‐assisted chemical etching

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