2017
DOI: 10.1016/j.msec.2016.12.045
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Vacuum arc plasma deposition of thin titanium dioxide films on silicone elastomer as a functional coating for medical applications

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Cited by 24 publications
(11 citation statements)
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“…TiO 2 is a common additive to improve OCT image quality and has been extensively used as an FDAapproved additive for use in both pharmaceuticals and cosmetics [36,37]. However, there has been recent concern that it could pose cytotoxic effects at some concentrations [54,55]. While an in depth characterization of TiO 2 toxicity is beyond the scope of the current work, if TiO 2 is deemed an issue then alternative contrast agents can be used such as gold nanoparticles [56] or even pigments found within the human body such as melanin [57].…”
Section: Discussionmentioning
confidence: 99%
“…TiO 2 is a common additive to improve OCT image quality and has been extensively used as an FDAapproved additive for use in both pharmaceuticals and cosmetics [36,37]. However, there has been recent concern that it could pose cytotoxic effects at some concentrations [54,55]. While an in depth characterization of TiO 2 toxicity is beyond the scope of the current work, if TiO 2 is deemed an issue then alternative contrast agents can be used such as gold nanoparticles [56] or even pigments found within the human body such as melanin [57].…”
Section: Discussionmentioning
confidence: 99%
“…真空弧放电是一种发生在真空环境下的阴阳极放电现象, 可电离几乎所有金 属元素,而且产生的离子密度高,被广泛应用在加速器、石油测井用中子管、真 空断路器、表面沉积和溅射、大功率真空开关等领域 [1][2][3][4][5][6] 。真空弧放电过程中, 除产生金属原子和离子外,还会伴随产生金属液滴 [7][8][9] 。液滴是阴极斑喷射到真 空中的金属颗粒,与阴极材料、表面熔融状态和等离子体参数等有关,对它的研 究可以获得阴极斑内部信息,这对真空弧放电研究具有非常重要的意义。但在工 程上,金属液滴属于大颗粒,沉积在样品表面会破坏材料表面涂层的均匀性,落 在器壁上形成金属微粒降低器件绝缘强度, 所以工程上希望尽量减少或避免金属 液滴的产生 [10,11] 。因此,对金属液滴行为的研究是真空弧放电机理及器件应用研 究的重要科学问题,具有非常重要的意义。 目前研究真空弧液滴最常用的方法是收集法。它是一种离线测量方法,通过 在阴极附近放置一块表面洁净的收集板, 等放电结束后用电子扫描显微镜观察收 集板上的液滴数量和直径分布。通过这种方法,S. Anders 等人研究了钨、铂、 铜等阴极金属材料和放电弧流对液滴直径分布的影响规律。对这些金属来说,液 滴直径大多介于 0.1 um~50 um 之间,而且直径越大,数量越少;阴极材料熔点 越低,液滴数量越多、直径越大;放电弧流仅影响液滴数量,不会改变粒径分布 [12] 。J.…”
Section: 引 言unclassified
“…() generated an argon‐copper plasma under low pressure and deposited the copper on inert surfaces using an electrical field ranging in strength from 30 to 150 W. They found that a field strength of 150 W deposited the most amount of copper evenly on the surfaces, and this correlated with an increased inhibitory effect of the surface against inoculated Pseudomonas species (De Vietro et al., ). Similar PECVD techniques have been used to create other antimicrobial and biocompatible surfaces such as silver‐encapsulated textiles (Brunon et al., ), copper alloy‐coated stainless steel (Wrona et al., ), and medical‐grade polydimethylsiloxanes covered in a titanium dioxide film (Boudot, Kühn, Kühn‐Kauffeldt, & Schein, ).…”
Section: Nanotechnology and Materials Science In Food Processingmentioning
confidence: 99%