UV-LIGA microfabrication of 220 GHz sheet beam amplifier gratings with SU-8 photoresists

Joye, Colin D.; Calame, J.P.; Garven, M.; Levush, B.

doi:10.1088/0960-1317/20/12/125016

Cited by 53 publications

(24 citation statements)

References 33 publications

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“…The second step is to remove the SU-8 from the copper structure. It is well known how difficult this phase is and numerous methods are proposed for the purpose [2]. This is particularly demanding in the regions between pillars, where very narrow spaces make arduous the removal.…”

Section: Su-8 Removal From the Metal Structurementioning

confidence: 99%

UV-LIGA microfabrication process for sub-terahertz waveguides utilizing multiple layered SU-8 photoresist

Malekabadi¹,

Paoloni²

2016

J. Micromech. Microeng.

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A microfabrication process based on UV LIGA (German acronym of lithography, electroplating and molding) is proposed for the fabrication of relatively high aspect ratio sub-terahertz (100 -1000 GHz) metal waveguides, to be used as slow wave structure (SWS) in sub-THz vacuum electron devices. The high accuracy and tight tolerances required to properly support frequencies in the sub-THz range can be only achieved by a stable process with full parameter control. The proposed process, based on SU-8 photoresist, has been developed to satisfy high planar surface requirements for metal sub-THz waveguides. It will be demonstrated that, for a given thickness, it is more effective the stacking of a number of layers of SU-8 with lower thickness rather than using a single thick layer obtained at lower spin rate. The multiple layer approach provides the planarity and the surface quality required for electroforming of ground planes or assembly surfaces and for assuring low ohmic losses of waveguides. A systematic procedure is provided to calculate soft and post-bake times to produce high homogeneity SU-8 multiple layer coating as mold for very high quality metal waveguides. A Double Corrugated Waveguide (DCW) designed for 0.3 THz operating frequency, to be used in vacuum electronic devices, was fabricated as test structure. The proposed process based on UV LIGA will enable low cost production of high accuracy sub-THz threedimensional waveguides. This is fundamental for producing a new generation of affordable sub-THz vacuum electron devices, to fill the technological gap that still prevents a wide diffusion of numerous applications based on THz radiation.

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Section: Su-8 Removal From the Metal Structurementioning

confidence: 99%

UV-LIGA microfabrication process for sub-terahertz waveguides utilizing multiple layered SU-8 photoresist

Malekabadi¹,

Paoloni²

2016

J. Micromech. Microeng.

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“…• C [17], [18]. Thus, the hardbake process was modified and performed under vacuum to prevent discoloration of the SU-8 and reduce the residual stress in the thick film structure [17].…”

Section: A Su-8 Valve Seat and Pressure Limitermentioning

confidence: 99%

A Modular Heat-Shrink-Packaged Check Valve With High Pressure Shutoff

Meng

2011

J. Microelectromech. Syst.

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“…For example, SU-8 is used as a permanent material for microfluidic devices [1]- [4] and packaging caps [5]. It is also used as an electroplating mold for ultraviolet (UV) LIGA process because of its unique ability to fabricate a high-aspect-ratio structure with nearly vertical sidewalls [3], [6]. BCB has excellent properties such as strong adhesiveness, small shrinkage during thermal curing, low outgassing, and high glass transition point.…”

Section: Introductionmentioning

confidence: 99%

Simple Removal Technology of Chemically Stable Polymer in MEMS Using Ozone Solution

Yoshida

Yanagida

Esashi

et al. 2013

J. Microelectromech. Syst.

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This paper reports simple removal technology for chemically stable polymers, such as SU-8, benzocyclobutene, polyimide, and carbonized resist, using ozone solution. Conventionally, these polymers are difficult to completely remove by O 2 plasma and organic solutions because of inorganic additives and chemical stabilities. In this paper, the removability of ozone solution to these polymers was investigated. Etching experiments using aqueous and acetic acid solutions of ozone were performed, and the surfaces of etched samples were analyzed by scanning electron microscopy and X-ray photoelectron spectroscopy. It was demonstrated that the polymers could be etched and completely removed using the acetic acid and/or aqueous solutions of ozone. This strong polymer removability of the ozone solutions is attributed to the strong organic decomposition ability of ozone and the rinse effect to inorganic materials in wet process.[ 2012-0018]Index Terms-Benzocyclobutene (BCB), ozone etching, polyimide, SU-8.

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UV-LIGA microfabrication of 220 GHz sheet beam amplifier gratings with SU-8 photoresists

Cited by 53 publications

References 33 publications

UV-LIGA microfabrication process for sub-terahertz waveguides utilizing multiple layered SU-8 photoresist

UV-LIGA microfabrication process for sub-terahertz waveguides utilizing multiple layered SU-8 photoresist

A Modular Heat-Shrink-Packaged Check Valve With High Pressure Shutoff

Simple Removal Technology of Chemically Stable Polymer in MEMS Using Ozone Solution

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