UV curable urethane encapsulant for ceramic chip carriers

Wilson, Jo

doi:10.1109/ectc.1994.367637

Cited by 5 publications

(2 citation statements)

References 5 publications

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“…Because there are many easy-to-break and wear spikes on the roller surface, these spikes affected maintaining performance and wear resistance of surface roughness for the roller. One of main reasons to replace the cold roller was the rapid attenuation of the roughness on the surface [8][9] . Explotation and development of more advanced roll surface texturing technology has become the current cold rolled sheet production factory of urgent needs.…”

Section: Introductionmentioning

confidence: 99%

Study of Parameters and Technics for Chrome-Plating Texturing

Tan

Sun

Liu

et al. 2010

AMR

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The generally textured techniques used in industry can make the roller surface fall off or damage by burning to form aculeate concave. The textured rollers produced by the method mentioned above have some disadvantage performances that include rapid roughness attenuation, limited use time and more concave. These disadvantages are not suitable for the formation of roughness on the cold roller surface. On account of high hardness and excellent wearable capability, the element chrome, which can be deposited on the cold roller surface, can increase the use life of textured cold roller enormously. In this paper, an experiment of DC superimposed pulse was performed to obtain certain roughness chrome textured and hemisphere-shaped chrome coatings. From the results, it was shown that the roughness and hardness of coating obtained by electroplating was 3.79μm at 850mA/cm2 and 1000 Hv respectively.

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Section: Introductionmentioning

confidence: 99%

Study of Parameters and Technics for Chrome-Plating Texturing

Tan

Sun

Liu

et al. 2010

AMR

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“…Two different filled epoxy systems are then used to encapsulate flip‐chip and edge lead solder structures. Package encapsulation is performed with a UV curable urethane conformal coating 10. Module part number and build coding are ink marked on this coating.…”

Section: Introductionmentioning

confidence: 99%

Assembly and Reliability of Very Large Flip‐chip on CQFP

Clementi¹,

Dearing

Bergeron

1996

Microelectronics International

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The IBM ceramic quad flat pack (CQFP) is a high performance, low‐cost chip carrier for surface mount assembly. It is an extension of metallised ceramic (MC) and metallised ceramic with polyimide (MCP) product technologies. These finished modules conform to JEDEC I/O and footprint standards. They are available in 0.5 mm and 0.4 mm lead pitches with flexibility to address unique application requirements such as body sizes or lead pitches. Connection from integrated circuit (IC) to carrier is performed using flip‐chip (C4 ‐ Controlled Collapse Chip Connection) attach. Silicon die size and the quantity of C4 connections for flip‐chip joining have historically been constrained to reduce early life failures caused by solder fatigue wearout. This DNP (distance from neutral point of chip footprint) limitation has been overcome with increasing usage of epoxy encapsulation as a flip‐chip underfill. The encapsulant matches the coefficient of thermal expansion (CTE) of C4 solder and minimises stresses on the interconnection. This enhancement provides a substantial reliability improvement in comparison with unencapsulated packages. Also, it enables larger die with smaller C4 solder bumps on finer pitches to be assembled on ceramic carriers. Recent product development and testing have extended flip‐chip on ceramic packaging technology even further than previously anticipated. Test die up to 20 mm in size with over 2,000 C4 joints have been successfully assembled, encapsulated, stress tested and qualified in CQEP modules. Flip‐chip assembly and encapsulation of C4 connections on very large die to CQFP components have been implemented into IBM manufacturing production. This large‐scale packaging enhancement continues to demonstrate that flip‐chip underfill eliminates the intrinsic failure mechanisms associated with fatigue wearout. This provides a significant technology extension to this low‐cost and high reliability product offering.

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