UV-crosslinked Polymeric Materials for Encapsulation of ZnO Nanowires in Piezoelectric Fingerprint Sensors

Bouvet-Marchand, A.; Loubat, M.; Graillot, Alain; Volk, János; Daukševičius, Rolanas; Saoutieff, Elise; Viana, A.; Christian, B.; Lebedev, V.; Sturm, Chris; Loubat, Cédric

doi:10.1016/j.proeng.2016.11.374

Cited by 3 publications

(2 citation statements)

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“…It is reported that zinc oxide nanoarrays, which gather the charge caused by the piezoelectric potential generated by each nano, can reconstitute the fingerprint’s three-dimensional deformation field [ 206 ]. For the sensor surface to be encased with a chemically inert UV-cross-linkable polymer [ 207 ], the encapsulation layer must have a thickness between 1.5 µm and 10 µm and possess excellent hydrophobicity and oleophobicity [ 208 ], as shown in Figure 9 . Hsiung [ 209 ] proposed an 8 × 32 pressure sensor array, with a cell size of 65 µm × 65 µm, a sensitivity of 0.39 fF/MPa, a maximum capacitance variation of 16%, and a resolution of 390 DPI, with no further film processing needed.…”

Section: Capacitive Fingerprint Recognitionmentioning

confidence: 99%

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A Review of Fingerprint Sensors: Mechanism, Characteristics, and Applications

Niu

et al. 2023

Micromachines

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Identification technology based on biometrics is a branch of research that employs the unique individual traits of humans to authenticate identity, which is the most secure method of identification based on its exceptional high dependability and stability of human biometrics. Common biometric identifiers include fingerprints, irises, and facial sounds, among others. In the realm of biometric recognition, fingerprint recognition has gained success with its convenient operation and fast identif ication speed. Different fingerprint collecting techniques, which supply fingerprint information for fingerprint identification systems, have attracted a significant deal of interest in authentication technology regarding fingerprint identification systems. This work presents several fingerprint acquisition techniques, such as optical capacitive and ultrasonic, and analyzes acquisition types and structures. In addition, the pros and drawbacks of various sensor types, as well as the limits and benefits of optical, capacitive, and ultrasonic kinds, are discussed. It is the necessary stage for the application of the Internet of Things (IoT).

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