Utilizing the thermodynamic nanoparticle size effects for low temperature Pb-free solder

Koppes, John P.; Grossklaus, Kevin A.; Muza, Anthony R.; Revur, Rao; Sengupta, Suvankar; Rae, Alan; Stach, Eric A.; Handwerker, Carol A.

doi:10.1016/j.mseb.2011.12.019

Cited by 21 publications

(9 citation statements)

References 27 publications

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“…These demands have inspired an array of solutions, especially those geared toward component bonding. Colloids, especially nanoparticles, have been used in welding,3d,4 soldering, brazing, and analogous processes . Use of nanomaterials, however, does not circumvent fabrication challenges and, in some cases, may introduce new difficulties …”

Section: Introductionmentioning

confidence: 99%

Heat‐Free Fabrication of Metallic Interconnects for Flexible/Wearable Devices

Martin

Chang

Martin³

et al. 2019

Adv Funct Materials

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Exploiting interfacial excess (Γ), Laplace pressure jump (ΔP), surface work, and coupling them to surface reactivity have led to the synthesis of undercooled metal particles. Metastability is maintained by a core-shell particle architecture. Fracture of the thin shell leads to solidification with concomitant sintering. Applying Scherer's constitutive model for loaddriven viscous sintering on the undercooled particles implies that they can form conductive traces. Combining metastability to eliminate heat and robustness of viscous sintering, an array of conductive metallic traces can be prepared, leading to plethora of devices on various flexible and/or heat sensitive substrates. Besides mechanical sintering, chemical sintering can be performed, which negates the need of either heat or load. In the latter, connectivity is hypothesized to occur via a Frenkel's theory of sintering type mechanism. This work reports heat-free, ambient fabrication of metallic conductive interconnects and traces on all types of substrates.

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Section: Introductionmentioning

confidence: 99%

Heat‐Free Fabrication of Metallic Interconnects for Flexible/Wearable Devices

Martin

Chang

Martin³

et al. 2019

Adv Funct Materials

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“…The tin-based Pb-free nanosolders such as pure Sn, Sn/Ag, Sn/Ag/Cu, and Sn/In alloy nanostructures have been successfully synthesized [17,20,40,53,55,[107][108][109]. Due to the lack of thermodynamic parameters of alloy systems (material properties), in general it is difficult to conduct theoretical calculations of the melting temperature of alloy systems, and most work has been focused on experimental measurements.…”

Section: Microjoining/nanojoining and Electronics Assemblymentioning

confidence: 99%

“…Koppers et al developed Sn nanosolder pastes (20 vol% metals loading) with nanosolder particle size of 5 nm and studied their melting temperatures [108]. A four-cycle DSC measurement was applied to characterize the thermodynamic properties of the nanoparticle/flux combinations, and the results are shown in Fig.…”

Section: Microjoining/nanojoining and Electronics Assemblymentioning

confidence: 99%

Melting Temperature of Metallic Nanoparticles

Gao

2015

Handbook of Nanoparticles

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Melting temperature is one of the fundamental properties of materials. In principle, the melting temperature of a bulk material is not dependent on its size. However, as the size of a material decreases toward the nanometer size and approaches atomic scale, the melting temperature scales with the material dimensions. The melting temperature of a nanomaterial such as nanoparticles (isotropic) and nanorods/nanowires (anisotropic) is related to other fundamental physical properties for nanomaterial applications, including catalysts, thermal management materials, electronics materials, and energy materials.This book chapter focuses on both the theoretical and experimental studies of metallic nanoparticle melting temperature depression. Thermodynamic modeling and molecular dynamic (MD) simulations are discussed regarding the melting behavior of different nanostructures, such as spherical nanoparticles and nanowires. The currently available measurement techniques by using classical differential scanning calorimetry (DSC), recently developed nanocalorimeters, transmission electron microscope (TEM), and optical methods are introduced. In addition, the applications of metal nanoparticles with lower melting temperatures are discussed, such as nanosoldering and sintering for electronics assembly and packaging.

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“…That makes it more difficult to optimize the reflow process for all components on the PCB. [1][2][3][4][5] To tackle this issue in the transition process toward Pb-free solders, a great many number of studies have been targeted on the synthesis of nanoparticles of pure Sn, 6 as well as near-eutectic SA 1,2 and SAC alloys 1,7,8 as promising candidates for the next generation of Pbfree solders due to their reduced melting temperatures.…”

Section: Introductionmentioning

confidence: 99%

“…As the oxidized particles require aggressive activation to be removed and do not melt at normal reflow temperatures, such particles will not be attached to a metal surface and will be carried away with the flux, leaving satellite solder balls. 1,13 Koppes et al 4 produced a nanosolder paste by combining the nanoparticles with flux and reported that although target melting temperatures were achieved, nanoparticle coalescence was limited due to the organic layer adsorbed on the metal surface during chemical synthesis, which was defined as a combination of the capping layer, excess flux and residual precursors. It was also reported that even the thin layer of tin oxide prevented the coalescence of the metallic tin.…”

Section: Introductionmentioning

confidence: 99%

Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength

Roshanghias

Khatibi

Yakymovych

et al. 2016

Journal of Elec Materi

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Although considerable research has been dedicated to the synthesis and characterization of lead-free nanoparticle solder alloys, only very little has been reported on the reliability of the respective joints. In fact, the merit of nanoparticle solders with depressed melting temperatures close to the Sn-Pb eutectic temperature has always been challenged when compared with conventional solder joints, especially in terms of inferior solderability due to the oxide shell commonly present on the nanoparticles, as well as due to compatibility problems with common fluxing agents. Correspondingly, in the current study, Sn-Ag-Cu (SAC) nanoparticle alloys were combined with a proper fluxing vehicle to produce prototype nanosolder pastes. The reliability of the solder joints was successively investigated by means of electron microscopy and mechanical tests. As a result, the optimized condition for employing nanoparticles as a competent nanopaste and a novel procedure for surface treatment of the SAC nanoparticles to diminish the oxide shell prior to soldering are being proposed.

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Utilizing the thermodynamic nanoparticle size effects for low temperature Pb-free solder

Cited by 21 publications

References 27 publications

Heat‐Free Fabrication of Metallic Interconnects for Flexible/Wearable Devices

Heat‐Free Fabrication of Metallic Interconnects for Flexible/Wearable Devices

Melting Temperature of Metallic Nanoparticles

Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength

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