2008
DOI: 10.1016/j.apsusc.2008.01.106
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Utilization of TXRF analytical technique in order to improve front-end semiconductor processing

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Cited by 7 publications
(2 citation statements)
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“…Control of surface contaminants on Si wafers is one of the most important applications. Budri in the U.S. described in-line TXRF monitoring, which provides analytical information on Al, Ti, and Mo with high throughput and a large sampling area (197). During implantation, which is an important semiconductor process, coimplanting of metallic contaminants occurs.…”
Section: Applicationsmentioning
confidence: 99%
“…Control of surface contaminants on Si wafers is one of the most important applications. Budri in the U.S. described in-line TXRF monitoring, which provides analytical information on Al, Ti, and Mo with high throughput and a large sampling area (197). During implantation, which is an important semiconductor process, coimplanting of metallic contaminants occurs.…”
Section: Applicationsmentioning
confidence: 99%
“…Budri has published an overview on ''the utilization of TXRF in order to improve front-end semiconductor processing''. 284 Although the overview contained only three references, it did summarize how the introduction of in-line TXRF monitoring can provide detailed information on Al, Mo and Ti contamination levels. Since it may be achieved in-line, several process steps may be improved which helps minimize product yield loss and also makes it possible to successfully manufacture multiple products and process geometries in the same fabrication platform.…”
Section: Reviews and Overviews A Review By Pisonero Andmentioning
confidence: 99%