1992
DOI: 10.1007/bf02319360
|View full text |Cite
|
Sign up to set email alerts
|

Using strain gages to measure both strain and temperature

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

0
16
0

Year Published

1993
1993
2024
2024

Publication Types

Select...
8

Relationship

1
7

Authors

Journals

citations
Cited by 21 publications
(16 citation statements)
references
References 2 publications
0
16
0
Order By: Relevance
“…On the other hand, MPA‐ and EDT‐treated thin films show an exponential decrease in resistance as temperature increases, as seen in Figure b. This indicates hopping transport, where electrons can hop to neighboring NCs more readily at higher temperatures . Hopping transport has an Arrhenius temperature dependence, which can be expressed by an exponential function:R=R0e EakBT eβlwhere k B , E a , T , β, and l are the Boltzmann constant, the activation energy for thermally induced hopping, temperature, the tunneling decay constant, and the interparticle distance of the NCs, respectively.…”
Section: Resultsmentioning
confidence: 97%
See 1 more Smart Citation
“…On the other hand, MPA‐ and EDT‐treated thin films show an exponential decrease in resistance as temperature increases, as seen in Figure b. This indicates hopping transport, where electrons can hop to neighboring NCs more readily at higher temperatures . Hopping transport has an Arrhenius temperature dependence, which can be expressed by an exponential function:R=R0e EakBT eβlwhere k B , E a , T , β, and l are the Boltzmann constant, the activation energy for thermally induced hopping, temperature, the tunneling decay constant, and the interparticle distance of the NCs, respectively.…”
Section: Resultsmentioning
confidence: 97%
“…The resistance of pure metallic materials is known to be proportional to temperature and strain, and can be expressed as follows: ΔRR0=αΔT+Gεwhere α corresponds to the TCR, Δ T is the temperature change in the Ag NC thin film, G is the gauge factor, and ε is the strain applied to the material. Higher order terms such as the thermal expansion coefficients of the substrate and NCs are not considered because resistance changes originating from these terms are minimal, and therefore, inconsequential . When calculating the TCR value for TBAB‐ and NH 4 Cl‐treated Ag NC thin films, the effects of strain can also be neglected because rigid substrates such as glass experience zero strain.…”
Section: Resultsmentioning
confidence: 99%
“…(17) are functions of temperature themselves. The transducer diaphragm where the strain gauge is bonded can also contract or elongate with temperature changes (Cappa et al, 1992;Richards, 1996;Vishay Micro-Measurement, 2007). This thermal output error is more prominent than that produced from the extraction or expansion of air column inside the venting tube in this experiment.…”
Section: Laboratory Resultsmentioning
confidence: 99%
“…Switch the selector to connect the calibration unit and set values (E~,,,E~~,,) that are close to the strain gauge outputs and read the digital strain metre readout ( E~, ,~~, E~~, , , , ) . 3. Evaluate the calibration coefficient.…”
Section: Experimental Procedures and Resultsmentioning
confidence: 99%