Using singular value decomposition to study near electromagnetic field of the 3D through silicon via array with high aspect ratio
Song-En Chen,
Chih-Chung Wang,
Jia-Han Li
Abstract:Inspecting the structure of the through silicon via (TSV) with high aspect ratio is important because they are used for 3D IC stacking. In reflectometry, simulation of near field data for TSV hole arrays is used to investigate reflection spectrum for TSV with different geometry parameters such as depth and top critical dimension. We investigate simulation results of electromagnetic field data for different TSV array using the finite-difference time-domain (FDTD) method. Near field simulation data are stored as… Show more
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