2011
DOI: 10.1007/s10894-011-9488-y
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Using Mather-Type Plasma Focus Device for Fabrication of Tungsten Thin Films

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Cited by 10 publications
(3 citation statements)
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“…The further details of the plasma Focus facilities are reported elsewhere [31]. A schematic arrangement of the experimental setup along with the focus subsystem is shown in Fig.…”
Section: Methodsmentioning
confidence: 99%
“…The further details of the plasma Focus facilities are reported elsewhere [31]. A schematic arrangement of the experimental setup along with the focus subsystem is shown in Fig.…”
Section: Methodsmentioning
confidence: 99%
“…In order to mitigate these issues, an innovative approach was proposed to deposit tungsten coatings on low-Z materials (such as graphite and C/C fiber composite) [3,4]. Nowadays, many coating techniques have been used to produce tungsten coatings on graphite substrates, i.e., physical vapor deposition (PVD), chemical vapor deposition (CVD), plasma spray (PS), combined magnetron sputtering and ion implantation (CMSII) and electrodeposition [5][6][7]. Among these kinds of coating technologies, electrodeposition method has unique advantages to fabricate tungsten coatings due to its simplicity, low cost and the satisfied properties of the obtained tungsten coatings [8][9][10].…”
Section: Introductionmentioning
confidence: 99%
“…17 Especially energetic ions and electrons generated by a PF device have been used for surface modification, 18 thermal surface treatment, 19 ion implantation 20,.21 and thin-film deposition. [22][23][24][25] PF devices can be used for thin-film deposition because of various interesting features, such as high deposition rate, energetic deposition and the possibility of deposition under a reactive background gas at high pressure. For example, in recent years, nitrogen gas has been used in PF devices as a reactive background gas for the deposition of industrially important nitrides such as TiN 26 , WN 27 , GaAs 28 , AlN 29 and ZrN.…”
mentioning
confidence: 99%