Using equivalent dielectric constant to simplify the analysis of patch microstrip antenna with multi-layer substrates

Ali, Wan Khairuddin Wan; Al-Charchafchi, S.H.

doi:10.1109/aps.1998.702028

Cited by 40 publications

(17 citation statements)

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“…The substrate thickness of 0.18 µm CMOS technology is 300µm. In order to speed up the simulation time, we employed the simplification method proposed by reference [11], in which the multi-permittivity of different layers was simplified into an equivalent permittivity, and this saves the simulation time and memory by 60% and 40%, respectively. …”

Section: Design Of Olr-bpf On Patterned Ground Shieldsmentioning

confidence: 99%

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60GHz-band low loss on-chip band pass filter with patterned ground shields for millimeter wave CMOS SoC

Pokharel

Liu

Dong

et al. 2011

2011 IEEE MTT-S International Microwave Symposium

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This paper presents a design of an improved on-chip open loop resonator band pass filter (OLR-BPF) for 60 GHz millimeter-wave applications in 0.18 µm CMOS technology. The proposed on-chip BPF employs the folded open loop structure on patterned ground shields. The adoption of a folded structure for the OLR-BPF and utilization of two transmissions zero permits a compact size and high selectivity for the BPF. In addition, the patterned ground shields obviously slowed down the guided waves, which enables a further reduction of the physical length of the resonator and finally an improvement of the insertion loss of the BPF. By comparison between the electromagnetic (EM) simulations and measurement results, the proposed BPF has the center frequency of 59 GHz, insertion loss 2.77 dB, band width 14 GHz, return loss is less than 27.5 dB, and chip size 910×650 µm 2 (including bonding pads).

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Section: Design Of Olr-bpf On Patterned Ground Shieldsmentioning

confidence: 99%

“…Since then, different types of patterned ground shields were studied. A few of the recent ones in CMOS technology are application in microstrip lines [10] and on-chip spiral inductors [11] to improve insertion loss and in turn, to achieve high Q-factor. Fig.…”

Section: Design Of Olr-bpf On Patterned Ground Shieldsmentioning

confidence: 99%

60GHz-band low loss on-chip band pass filter with patterned ground shields for millimeter wave CMOS SoC

Pokharel

Liu

Dong

et al. 2011

2011 IEEE MTT-S International Microwave Symposium

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“…To verify that the thickness of the layers does not change during the graded substrate formation, the relative dielectric permittivity of the graded substrate structure (ε rc ) is calculated using the multilayer formulation as used in [20,21] and compared with experimental results. The theoretical relative dielectric permittivity for three layer substrate is expressed as, where h i is the height of the i th layer and ε ri is is the dielectric permittivity of the i th layer.…”

Section: Microwave Characterizationmentioning

confidence: 99%

Study of graded composite (LDPE/TIO₂) materials as substrate for microstrip patch antennas in X-band

Sarmah

Bhattacharyya

2013

IEEE Trans. Dielect. Electr. Insul.

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TiO 2 (titania) reinforced low density polyethylene (LDPE) composite is studied as substrate for microstrip patch antenna that is to be used in microwave X band (8 GHz to 12 GHz). Physical, thermal and microwave characterization of the composite is done to confirm the applicability of the composite material as substrate for microstrip antennas. Microstrip antenna with rectangular radiating patch is fabricated on composites with different volume fraction (VF) of filler in polymer as substrate. S11 measurements are carried out on the antenna designed on different substrates using vector network analyzer. To increase the operational bandwidth of the antenna three layer grading of the composite substrate is done. The bandwidth and S11 parameter performance of the antenna is found to be improved by using graded composite as substrate material. Enhancement of directivity is observed for graded substrate as compared to ungraded substrate.

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“…1) The equivalent relative permittivity and total thickness of the two substrates are given by [17].…”

Section: Phasing Element Configuration and Design Proceduresmentioning

confidence: 99%

Modified Phasing Element for Broadband Reflectarray Antennas

Elshennawy¹,

Attiya²

2017

PIER C

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Abstract-New phasing element for a wideband microstrip reflectarray is presented. It is formed by a phase-delay line attached to a circular ring loaded with a circular disc microstrip. The structure is enclosed by a circular ring element with a pair of gaps. It is shown that the new phasing element offers a wider bandwidth with an increased phasing range that is useful in reflectarrays phase compensation procedure. Full wave EM simulations are carried out. Good agreement exists between simulation results and measurements by using waveguide simulator method. The mutual coupling effect for a realistic reflectarray configuration with non-identical cells is accounted for by using the perturbation technique.

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Using equivalent dielectric constant to simplify the analysis of patch microstrip antenna with multi-layer substrates

Cited by 40 publications

References 1 publication

60GHz-band low loss on-chip band pass filter with patterned ground shields for millimeter wave CMOS SoC

60GHz-band low loss on-chip band pass filter with patterned ground shields for millimeter wave CMOS SoC

Study of graded composite (LDPE/TIO₂) materials as substrate for microstrip patch antennas in X-band

Modified Phasing Element for Broadband Reflectarray Antennas

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Using equivalent dielectric constant to simplify the analysis of patch microstrip antenna with multi-layer substrates

Cited by 40 publications

References 1 publication

60GHz-band low loss on-chip band pass filter with patterned ground shields for millimeter wave CMOS SoC

60GHz-band low loss on-chip band pass filter with patterned ground shields for millimeter wave CMOS SoC

Study of graded composite (LDPE/TIO2) materials as substrate for microstrip patch antennas in X-band

Modified Phasing Element for Broadband Reflectarray Antennas

Contact Info

Product

Resources

About

Study of graded composite (LDPE/TIO₂) materials as substrate for microstrip patch antennas in X-band