Use of low cost plastic DIPs and injection molded parts in packaging of optical data links

Acarlar, M.S.; Moyer, S.; Robinson, S.D.

doi:10.1109/ectc.1992.204274

Cited by 11 publications

(4 citation statements)

References 3 publications

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“…Regardless of the application though, most true-hermetic optical module feedthroughs consist of a solder or solder-glass sealed optical fiber [4]- [6], window, lens, or ferrule assembly [7]- [9] that is integral to the package sidewall, or is subsequently sealed through the package sidewall by brazing, soldering or welding. In cases where true-hermetic packaging is not essential [10], polymeric encapsulant materials functioning as environmental sealants often suffice as a replacement for the solder and solder-glass hermetic sealants.…”

Section: Introductionmentioning

confidence: 99%

Characterization of 63Sn37Pb and 80Au2OSn solder sealed optical fiber feedthroughs subjected to repetitive thermal cycling

Beranek

Rassaian

Tang

et al. 2001

IEEE Trans. Adv. Packag.

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A highly accurate prediction of hermeticity lifetime is made for eutectic 63Sn37Pb and 80Au20Sn alloy solder sealed optical fiber-Kovar™ nosetube feedthroughs subjected to repetitive thermal cycling. Thermal fatigue fracture of the Sn-Pb solder/Kovar™ interface develops when cracks, initially generated from creep deformation of the solder, propagate gradually through the junction in the axial direction. A nonlinear axisymmetric finite element analysis of the 63Sn37Pb fiber feedthrough seal is performed using a thermo-elastic creep constitutive equation, and solder joint fatigue based on accumulated strain energy associated with solder creep imposed by temperature cycling is analyzed. Additionally, thermal effective stress and plastic strain is studied for alternative 80Au20Sn solder by the finite element method with results indicating significant increase in useful life as compared to 63Sn37Pb. SEM/EDX metallurgical analysis of the solder/Ni-Au plated Kovar™ nosetube interface indicates that AuSn 4 intermetallic formed during soldering with 63Sn37Pb also contributes to joint weakening, whereas no brittle intermetallic is observed for 80Au20Sn. Hermetic carbon coated optical fibers metallized with Ni,P-Ni underplate and electrolytic Au overplating exhibit correspondingly similar metallurgy at the solder/fiber interface. Combined hermeticity testing and metallurgical analysis carried out on 63Sn37Pb and 80Au20Sn alloy solder sealed optical fiber feedthroughs after repetitive temperature cycling between 65 and +150 C, and 40 and +125 C validated the analytical approach.Index Terms-80Au20Sn, FEM, fiber-optic, helium leak, hermetic feedthrough, intermetallic, Kovar™, SEM/EDX, 63Sn37Pb, solder.

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Section: Introductionmentioning

confidence: 99%

Characterization of 63Sn37Pb and 80Au2OSn solder sealed optical fiber feedthroughs subjected to repetitive thermal cycling

Beranek

Rassaian

Tang

et al. 2001

IEEE Trans. Adv. Packag.

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“…Improvements to date in datalink assembly methods have focused primarily on applying traditional integrated circuit packaging techniques [3,4,5]. This approach leaves in place expensive optical and mechanical components such as lensed TO caps, stainless steel bores with case attachment features, ceramic headers, fiber stubs, bores, and split sleeves, and gradient index lenses.…”

Section: Introductionmentioning

confidence: 99%

Polymer molded lenses for optoelectronics

Heiney¹,

Jiang²,

Reysen³

1995 Proceedings. 45th Electronic Components and Technology Conference

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Further enhancements to a novel optical packaging technology for datalinks are reported. Evolutionary improvements in the design, processes, and implementations of the integrated lensireceptacle have been made. A new mechanical package for FDDI using the lensireceptacle has been designed in addition to the original SC-duplex and SCiST-simplex styles. Details of the mechanical and optical design, production issues, and performance statistics are reported.The basis for this low cost packaging approach is independent integration of the optical connector and electronic functions. Precision polymer molding technology has been used to design a multifunction element providing connector ferrule seating, optoelectronic device and fiber plane placement, connector feature integration, case and process sealing, and efficient optical coupling at right angles to the fiber axis. The last feature allows for assembly of the optoelectronic devices on the same board with the circuit components. Besides ease ,of testing and cost reduction, eliminating the TO header in this way improves electrical and thermal performance.

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“…The current trend in Optical Data Links (ODL) is the miniaturization and cost reduction of optoelectronic devices for Local Area Network (LAN) applications [1,2]. This calls for high-quality, high volume, sophisticated products with short design and manufacturing cycle times.…”

Section: Introductionmentioning

confidence: 99%

Design of a compact, high speed optical transceiver using two step overmolding

Anigbo¹,

Robinson²,

Broutin³

et al.

1995 Proceedings. 45th Electronic Components and Technology Conference

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A low cost, compact optical transceiver has been designed for emerging FDDI and Fiber Channel Local Area Networks (LANs). This transceiver has been designed to meet the growing volumes and rapidly falling prices in the FDDI marketplace. The package is designed to be fully compliant with an industry standard package outline and footprint. This optical data link (ODL) contains a duplex SC connector receptacle -compatible with the ANSI Fiber Channel and low cost FDDI standards. With a single row of 9 pins, the transceiver will occupy less than 1.0 square inch of board space.This ODL transceiver has been designed using two step overmold packaging technology. This technology integrates optical and electrical components in a single, sealed, transfer molded package. This package design uses copper based leadframe to provide low cost interconnection and mass handling. The final assembly sequence was conceived using the latest Design for Simplicity (DFS) principles. This paper will describe the design concept and challenges required to implement a full transceiver in such a small size. Thermal analysis results will be discussed. Electrical design issues such as cross-talk and extemal noise immunity will also be described. Initial performance results using preliminary design models will be reported.

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Use of low cost plastic DIPs and injection molded parts in packaging of optical data links

Cited by 11 publications

References 3 publications

Characterization of 63Sn37Pb and 80Au2OSn solder sealed optical fiber feedthroughs subjected to repetitive thermal cycling

Characterization of 63Sn37Pb and 80Au2OSn solder sealed optical fiber feedthroughs subjected to repetitive thermal cycling

Polymer molded lenses for optoelectronics

Design of a compact, high speed optical transceiver using two step overmolding

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