Use of a laser disc for cutting silicon wafers

Musztyfaga-Staszuk, Małgorzata; Janicki, D.; Pánek, P.; Wiśniowski, M.

doi:10.17222/mit.2017.052

Cited by 2 publications

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“…It can be concluded, based on the test results presented in table 6, that the shift in the position of the main Si line with the increase in ELB is very clear. The occurring line widening at five values may be associated with the occurrence of the amorphous phase Si as well as Al clusters in the matrix of the Si crystal lattice [9] [10]. Figure 6 shows an example of the SEM microstructure which shows the heterogeneity of surface morphology in the LFC area.…”

Section: Discussion Of the Results Of Laser Micromachiningmentioning

confidence: 99%

“…In the Welding Department and the Department of Materials Process Technology and Computer Techniques in Materials Science at the Department of Engineering and Biomedical Materials of the Silesian University of Technology in Gliwice, the use of lasers in surface engineering was studied. The main area of research in the field of photovoltaics concerned the issues of technology for the production of crystalline silicon photovoltaic cells with the adaptation of laser technologies to texturing the surface of polycrystalline silicon [1][2][3][4] in order to reduce the solar radiation reflection coefficient and increase the efficiency of these cells; manufacturing silicon solar cell components from monocrystalline silicon, including selective laser sintering of the front electrode to its surface, using a CO2 laser [5][6][7][8][9] having an effect on improving the quality of the cell by minimizing the resistance of the connection of the front electrode to the substrate; cutting monocrystalline silicon with a disk laser [10].…”

Section: Introductionmentioning

confidence: 99%

“…Example Conditions of laser treatment of silicon (where: the distance between the nozzle and the surface of a wafer of 450 µm)[10] …”

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confidence: 99%

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The Use of Lasers at Various Stages of the Manufacturing Process of Solar Cells Based on Crystalline Silicon

Musztyfaga-Staszuk

Pánek

2020

SSP

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The purpose of this chapter of the book is to present knowledge on the use of laser technology in silicon photovoltaic cell manufacturing processes. Particular consideration was given to the technique of using a disk laser to cut the edges of silicon wafers together with the recognition of the flow of laser micromachining on the quality of cut edges to obtain their minimal deformation. The second topic described is the method of producing point contacts employing laser radiation between a layer of vaporised aluminium and crystalline silicon using the Nd:YAG laser. The results illustrating the impact of the structure and parameters of point contact for a given laser radiation energy on basic electrical parameters for complete, prototype solar cells are included. The chapter in the book provides an overview of the literature on the above topics and presents selected results of experimental works carried out by the authors. The motive for its publication is the need to present selected results of own research carried out in the Welding Department cooperating for many years with the Institute of Engineering and Biomedical Materials (IMIiB) of the Silesian University of Technology and the Institute of Metallurgy and Materials Engineering (IMIM) of the Polish Academy of Sciences in Cracow.

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Section: Discussion Of the Results Of Laser Micromachiningmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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The Use of Lasers at Various Stages of the Manufacturing Process of Solar Cells Based on Crystalline Silicon

Musztyfaga-Staszuk

Pánek

2020

SSP

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Copper Oxides on a Cu Sheet Substrate Made by Laser Technique

et al. 2020

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This paper presents results from the production of copper oxide layers on a Cu sheet substrate using diode and Yb:YAG disc lasers operating in the wavelength ranges of 808–940 nm and 1030 nm. The parameters of these layers were compared with the layer obtained in the thermal process of copper oxidation at 300 °C in an infrared (IR) furnace in a natural atmosphere. Investigations into the layers mentioned above, concerning their topography, chemical composition and roughness, were made using scanning electron microscopy (SEM) and atomic force microscopy (AFM). A hot-point probe was used to determine and check the type of conductivity of the copper oxide layers formed. The optical band gap energy was estimated by applying the Kubelka–Munk method based on spectrophotometric data. Cross-sections and the element distribution maps were made using transmission electron microscopy (TEM). The phase analysis was investigated by the X-ray diffraction method (XRD). In sum, controlled laser oxidations of copper sheets allow for the formation of a mixture of Cu2O and CuO phases. The diode laser allows the production of a layer of copper oxides with a phase composition comparable to the oxides produced by the thermal oxidation method, while the distribution of high phase uniformity in the cross-section of the layer enables the process using a Yb:YAG disc laser.

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Use of a laser disc for cutting silicon wafers

Cited by 2 publications

References 0 publications

The Use of Lasers at Various Stages of the Manufacturing Process of Solar Cells Based on Crystalline Silicon

The Use of Lasers at Various Stages of the Manufacturing Process of Solar Cells Based on Crystalline Silicon

Copper Oxides on a Cu Sheet Substrate Made by Laser Technique

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