Unveiling the interface characteristics and their influence on the heat transfer behavior of hot-forged Cu–Cr/Diamond composites

Jia, Shanquan; Bolzoni, Leandro; Li, Tong; Yang, Fei

doi:10.1016/j.carbon.2020.10.036

Cited by 52 publications

(14 citation statements)

References 53 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Jia et al have utilized theoretical models like DEM and AMM to predict the effect of interconnected interfacial carbide in Cu/diamond composites, and they found that the G between Cu and diamond depends on the coverage and thickness of the interfacial carbide. 6 In this field, the experimental measurement of the G for the Cu/interconnected interlayer/diamond structure is still lacking. The effect of the interconnected interlayer on the G between Cu and diamond is not fully understood.…”

Section: Introductionmentioning

confidence: 99%

“…Second, vibrational spectra of Cu and diamond have huge dissimilarities because of the distinct bond natures. Various carbides have been introduced in between Cu and diamond by diamond surface metallization or metal matrix alloying, with carbide-forming elements such as B, Cr, Ti, Zr, Mo, and W, to overcome the disadvantages. − …”

Section: Introductionmentioning

confidence: 99%

“…However, in the Cu/diamond composites modified by metal matrix alloying, the interfacial carbide is in situ formed at the Cu/diamond interface, and a discontinuous interfacial carbide is manipulated to achieve a thin carbide interlayer. , The discontinuous interfacial carbide in the Cu/diamond composites shows an essential feature that the Cu/carbide/diamond transition area and the Cu/diamond contact area are interconnected at the interface. Jia et al have utilized theoretical models like DEM and AMM to predict the effect of interconnected interfacial carbide in Cu/diamond composites, and they found that the G between Cu and diamond depends on the coverage and thickness of the interfacial carbide . In this field, the experimental measurement of the G for the Cu/interconnected interlayer/diamond structure is still lacking.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Interfacial Thermal Conductance between Cu and Diamond with Interconnected W−W₂C Interlayer

Zhang

Wang

et al. 2022

ACS Appl. Mater. Interfaces

View full text Add to dashboard Cite

Manipulating the interfacial structure is vital to enhancing the interfacial thermal conductance (G) in Cu/diamond composites for promising thermal management applications. An interconnected interlayer is frequently observed in Cu/diamond composites; however, the G between Cu and diamond with an interconnected interlayer has not been addressed so far and thus is attracting extensive attention in the field. In this study, we designed three kinds of interlayers between a Cu film and a diamond substrate by magnetron sputtering coupled with heat treatment, including a W interlayer, an interconnected W–W2C interlayer, and a W2C interlayer, to comparatively elucidate the relationship between the interfacial structure and the interfacial thermal conductance. For the first time, we experimentally measured the G between Cu and diamond with an interconnected interlayer by a time-domain thermoreflectance technique. The Cu/W–W2C/diamond structure exhibits an intermediate G value of 25.8 MW/m2 K, higher than the 19.9 MW/m2 K value for the Cu/W2C/diamond structure and lower than the 29.4 MW/m2 K value for the Cu/W/diamond structure. The molecular dynamics simulations show that the G of the individual W2C/diamond interface is much higher than those of the individual Cu/diamond and W/diamond interfaces and W2C could reduce the vibrational mismatch between Cu and diamond; however, the G of the Cu/W2C/diamond structure is reduced by the lower thermal conductivity of W2C. This study provides insights into the relationship between the interconnected interfacial structure and the G between Cu and diamond and offers guidance for interface design to improve the thermal conductivity in Cu/diamond composites.

show abstract

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Interfacial Thermal Conductance between Cu and Diamond with Interconnected W−W₂C Interlayer

Zhang

Wang

et al. 2022

ACS Appl. Mater. Interfaces

View full text Add to dashboard Cite

show abstract

“…[21][22][23][24] Meanwhile, metals with high ductility minimize the effects owing to lattice and thermal misfit. 25,26 Furthermore, interfacial metal carbides enable fine surface adherence.…”

Section: Introductionmentioning

confidence: 99%

Effective diamond deposition on Ti:sapphire with a Cr interlayer via microwave plasma chemical vapor deposition

Zhu

Zhang

et al. 2023

CrystEngComm

View full text Add to dashboard Cite

show abstract

“…[4][5][6] D reinforced metal matrix composites, in particular, are frequently used in cutting tools, wear-resistant coatings, and electronic packaging materials. [7][8][9] However, because of their poor wettability, D and metal are difficult to obtain a strong interface bonding, making it difficult to improve the properties of composites. [10] Therefore, to improve the performance of composites, it is necessary to improve the interface bonding state between D and metal.…”

Section: Introductionmentioning

confidence: 99%

Effect of Chlorine Salts on TiC Coating Morphology and Bonding Strength of Diamond Surface in Molten Salt Reaction

Meng

Huang

2023

Cryst. Res. Technol.

View full text Add to dashboard Cite

To obtain a high‐quality TiC coating on the diamond (D) surface and improve the interfacial properties of metal matrix composites, the optimized molten salt method is used to prepare TiC coatings on the D surface. The effects of NaCl, KCl, and NaCl–KCl molten salts on the uniformity, surface morphology, composition, and bonding ability of TiC coatings are investigated by scanning electron microscopy, energy‐dispersive X‐ray spectroscopy (EDS), X‐ray diffraction, and cold–hot cycling experiments. The results show that the boiling and pickling processes after the molten salt reaction can effectively remove the residual chloride salts and Ti powders to obtain clean TiC‐coated D. The TiC particles of the coating surfaces prepared by NaCl and KCl molten salts are finer and more uniform, which is due to their higher melting points and shorter real reaction time compared with NaCl–KCl mixed salts. The TiC coating prepared by KCl has the best bonding ability and can withstand 50 times as many cold–hot cycles due to its uniform fine deposition particles and appropriate thickness. And, during cold–hot cycles, it can be found that the TiC coating cracking and shedding occur primarily at the edges and corners of the D with internal thermal stress concentration.

show abstract

Unveiling the interface characteristics and their influence on the heat transfer behavior of hot-forged Cu–Cr/Diamond composites

Cited by 52 publications

References 53 publications

Interfacial Thermal Conductance between Cu and Diamond with Interconnected W−W₂C Interlayer

Interfacial Thermal Conductance between Cu and Diamond with Interconnected W−W₂C Interlayer

Effective diamond deposition on Ti:sapphire with a Cr interlayer via microwave plasma chemical vapor deposition

Effect of Chlorine Salts on TiC Coating Morphology and Bonding Strength of Diamond Surface in Molten Salt Reaction

Contact Info

Product

Resources

About

Unveiling the interface characteristics and their influence on the heat transfer behavior of hot-forged Cu–Cr/Diamond composites

Cited by 52 publications

References 53 publications

Interfacial Thermal Conductance between Cu and Diamond with Interconnected W−W2C Interlayer

Interfacial Thermal Conductance between Cu and Diamond with Interconnected W−W2C Interlayer

Effective diamond deposition on Ti:sapphire with a Cr interlayer via microwave plasma chemical vapor deposition

Effect of Chlorine Salts on TiC Coating Morphology and Bonding Strength of Diamond Surface in Molten Salt Reaction

Contact Info

Product

Resources

About

Interfacial Thermal Conductance between Cu and Diamond with Interconnected W−W₂C Interlayer

Interfacial Thermal Conductance between Cu and Diamond with Interconnected W−W₂C Interlayer