Unraveling the hydrogen sulfide aging mechanism on electrical-thermal–mechanical property degradation of sintered nanocopper interconnects used in power electronics packaging

Chen, Wei; Liu, Xu; Hu, Dong; Liu, Xu; Zhu, Xi; Fan, Xuejun; Zhang, Guoqi; Fan, Jiajie

doi:10.1016/j.matdes.2024.112702

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Unraveling the hydrogen sulfide aging mechanism on electrical-thermal–mechanical property degradation of sintered nanocopper interconnects used in power electronics packaging

Cited by 2 publications

References 54 publications

Rapid on-site nondestructive surface corrosion characterization of sintered nanocopper paste in power electronics packaging using hyperspectral imaging

Rapid on-site nondestructive surface corrosion characterization of sintered nanocopper paste in power electronics packaging using hyperspectral imaging

Molecular Dynamics Assisted Corrosion-Resistant Evaluation of Encapsulation Materials on Copper Used in Power Electronics Packaging

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