2013 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) 2013
DOI: 10.1109/sispad.2013.6650593
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Unified FinFET compact model: Modelling Trapezoidal Triple-Gate FinFETs

Abstract: A unified FinFET compact model is proposed for devices with complex fin cross-sections. It is represented in a normalized form, where only four different model parameters are needed. The proposed model accurately predicts the currentvoltage characteristics of different FinFETs structures such as Double-Gate (DG), Cylindrical Gate-All-Around (Cy-GAA), or Rectangular Gate-All-Around (Re-GAA) FinFETs. In addition, for the first time, Trapezoidal Triple-Gate (T-TG) FinFETs are accurately modelled. Short-Channel-Ef… Show more

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Cited by 31 publications
(6 citation statements)
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“…FinFET structures such as DG, Cy-GAA, Re-GAA, and rounded trapezoidal TG FinFETs are all modeled under the same framework. The model presented in this section has been recently being incorporated to BSIM-CMG [23]. The proposed core model can be used with shortchannel-effect submodels in a similar manner as was done in previous versions of BSIM-CMG models [27].…”
Section: Figure 310mentioning
confidence: 99%
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“…FinFET structures such as DG, Cy-GAA, Re-GAA, and rounded trapezoidal TG FinFETs are all modeled under the same framework. The model presented in this section has been recently being incorporated to BSIM-CMG [23]. The proposed core model can be used with shortchannel-effect submodels in a similar manner as was done in previous versions of BSIM-CMG models [27].…”
Section: Figure 310mentioning
confidence: 99%
“…Several compact models have been proposed for FinFETs with complex crosssectional shapes. In this section, on the basis of the approach presented in [23], a new normalized unified FinFET core model is presented [23]. In [28], a compact model for undoped or lightly doped FinFETs was extended to model FinFETs with different crosssectional shapes by obtaining an equivalent channel thickness for each structure.…”
Section: Figure 310mentioning
confidence: 99%
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“…1 [6][7][8]. Although a FinFET is believed to have uniform thickness across the height of a fin, the trapezoidal cross section has been found to be markedly different from the idealized rectangular fin body in many studies [9]. It is not clearly known whether the nonvertical cross section of the fins are manufacturing artifacts or are deliberately engineered to provide useful benefits in the chip.…”
Section: Introductionmentioning
confidence: 99%