2024
DOI: 10.1039/d3cp05407a
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Unexpected reduction in thermal conductivity observed in graphene/h-BN heterostructures

Zhang Wu,
Rumeng Liu,
Ning Wei
et al.

Abstract: Heterostructures find wide-ranging applications in fields such as thermal management, thermoelectric energy conversion, and nanoelectronics. This study provides new insights into the thermal conductivity of parallel heterointerfaces by investigating a...

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“…These nanocrystals have demonstrated excellent electrocatalytic activity in the hydrogen evolution reaction, comparable to commercial Pt electrodes. , The study found that natural defects and external impurities have a significant impact on the performance of SiC, with the presence of defects significantly reducing the overall carrier mobility of SiC. The effects on mechanical and electrical properties are also widespread. , In terms of thermal management, the thermal transport properties can be effectively controlled through temperature, external strain, and magnetic. During the experimental preparation process, the influence of grain boundary angles, strains, and defects often occurs. Although our previous research has provided valuable insights into the thermal properties of SiC, there is still a lack of comprehensive understanding regarding the combined effects of these factors, especially considering the dual interfaces formed by different bonding types in the SiC GB structure and the application of strain engineering on the SiC GB structure.…”
Section: Introductionmentioning
confidence: 99%
“…These nanocrystals have demonstrated excellent electrocatalytic activity in the hydrogen evolution reaction, comparable to commercial Pt electrodes. , The study found that natural defects and external impurities have a significant impact on the performance of SiC, with the presence of defects significantly reducing the overall carrier mobility of SiC. The effects on mechanical and electrical properties are also widespread. , In terms of thermal management, the thermal transport properties can be effectively controlled through temperature, external strain, and magnetic. During the experimental preparation process, the influence of grain boundary angles, strains, and defects often occurs. Although our previous research has provided valuable insights into the thermal properties of SiC, there is still a lack of comprehensive understanding regarding the combined effects of these factors, especially considering the dual interfaces formed by different bonding types in the SiC GB structure and the application of strain engineering on the SiC GB structure.…”
Section: Introductionmentioning
confidence: 99%