Journal of Alloys and Compounds
 2024
DOI: 10.1016/j.jallcom.2024.174744
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Understanding the role of additional Cu intercalation in electronic and thermal properties of p-type Cu2.9Te2-incorporated Bi0.5Sb1.5Te3 thermoelectric alloys

Hyunjin Park,
Mujde Yahyaoglu,
Sang-il Kim
et al.
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