2023
DOI: 10.1016/j.matchar.2023.113136
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Understanding of highly-oriented 3C-SiC ductile-brittle transition mechanism in ELID ultra-precision grinding

Meijun Yang,
Cong Liu,
Bingjian Guo
et al.
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Cited by 3 publications
(1 citation statement)
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“…Shamray et al [23] investigated the ductile-to-brittle transition behaviors of Si 3 N 4 ceramics, and a Si 3 N 4 substrate with a ductile surface and subsurface was obtained by controlling the maximum undeformed chip thickness. Yang et al [24] investigated the ductile removal phenomenon of 3C-SiC involved in precision grinding process. Electrolytic in-process dressing was found to facilitate the generation of a compressive residual stress, enabling ductile removal of 3C-SiC.…”
Section: Introductionmentioning
confidence: 99%
“…Shamray et al [23] investigated the ductile-to-brittle transition behaviors of Si 3 N 4 ceramics, and a Si 3 N 4 substrate with a ductile surface and subsurface was obtained by controlling the maximum undeformed chip thickness. Yang et al [24] investigated the ductile removal phenomenon of 3C-SiC involved in precision grinding process. Electrolytic in-process dressing was found to facilitate the generation of a compressive residual stress, enabling ductile removal of 3C-SiC.…”
Section: Introductionmentioning
confidence: 99%