Underfill selection strategy for low k, high lead/lead-free flip chip application

Effect of Underfill Mechanical Property on Cu/Low-K Delamination for Lead-Free Flip Chip Packaging

“…K. C. Chang et al [3] illustrated some design guidance for increasing the reliability of low-K FC-BGA assemblies by simulation. W. H. Lee et al [4] demonstrated the underfill selection process and concerns for the low-K, high lead/lead-free flip-chip packaging. Most papers have indicated that the underfill selection strategy for reducing the Cu/low-K delamination and bump crack is on the contrary.…”