2024
DOI: 10.3390/electronics13050839
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Ultrathin Antenna-in-Package Based on TMV-Embedded FOWLP for 5G mm-Wave Applications

Yuhang Yin,
Chenhui Xia,
Shuli Liu
et al.

Abstract: In this paper, a novel through mold via (TMV)-embedded fan-out wafer-level package (FOWLP) technology was demonstrated to manufacture the well-designed Antenna in Package (AiP) with ultrathin thickness (0.04 λ0). Double-sided redistribution layers (RDLs) were employed to build the patch antenna, while a TMV interposer was used to connect the front and back RDLs. By optimizing the AiP’s parameters, the patch antenna can achieve a wide impedance bandwidth of 17.8% from 24.2 to 28.5 GHz, which can cover the 5G fr… Show more

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Cited by 2 publications
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