“…The different materials as the second solid phase in powder, whiskers, or fiber forms can be suspended in an electroplating bath and embedded into a metal deposit during the co-deposition process. Common materials used to reinforce the copper metal matrix were metal ceramic oxides such as corundum (Al 2 O 3 ) [13,14,16,17], silica (SiO 2 ) [18][19][20], titanium oxide (TiO 2 ) [21][22][23], CeO 2 [24], zirconia (ZrO 2 ) [25], Y 2 O 3 [26], nitrides (Si 3 N 4 ) [27,28], silicon carbide (SiC) [29,30], carbon nanotubes (CNTs) [31], multi-walled carbon nanotubes (MWCNTs) [32], graphene (Gr) and its derivatives such as graphene oxides (GO) and reduced graphene oxides (RGO) [33][34][35][36][37], diamonds [38,39], and LDH (layered double hydroxide) [40].…”