Ultrasonic soldering in electronics

Abstract

Ultrasonic (US) soldering of electronic components, as an alternative to flux soldering, is environmentally friendly, improves the quality of soldered connections at the mounting elements after long-term storage, and allows the use of lead-free solders. Methods of US solder melt activation, lead-free solders in US soldering and glass-ceramic capacitor metallization processes have been investigated.

Joining of Cf/SiC Ceramic Matrix Composites: A Review

“…Ultrasonic-assisted joining is employed to join aluminum alloy structural parts at first. Afterward, ultrasonic is used for copper and alloy, gradually widely used in CMCs and metals, as shown in Figure 14 [86]. Since ultrasound exists as an energy form, it produces some unique ultrasonic effects when it propagates in the medium.…”

The Morphology of al Droplet in an Ultrasonic Oscillation Field: Kinetic and Equilibrium Thermodynamic Analysis

“…The forced oscillation can also change the wettability of liquid droplet on a flat surface as was shown by Chaudhury, the experiment was performed with a water drop and in laboratory settings 29 , and later on it becomes a pilot project for lateral migration of oscillatory flows [30][31][32] . Similarly, researchers observe the existence of wettability oscillation of metal filler materials 33 , according to the phenomena, metal droplets in soldering are forced to spread on substrate materials which were hard to weld, with the same mechanism, vibrating squeegee, vibratory arc surfacing and ultrasonic soldering 34,35 . Till now, research have not reached a consensus on the driven force of high-temperature molten drop oscillations, certain laws of wetting front instability 36,37 , and contact line mobility in vibration systems remain unclear 38 .…”

Kinetics of Dissolution of Copper in Liquid Tin With Ultrasonic Waves

“…As one of these methods, ultrasonic-assisted soldering has been widely used for electronic packaging. Compared to the traditional soldering method, ultrasonic-assisted soldering can promote the wetting of solder on the substrate 1,2 , remove the oxide film on the surface of the substrate to avoid the problem of residual corrosion of the joint interface flux, and refine grains to improve the shear strength of the solder joint [3][4][5] . It is suitable for the connection of complex shapes and structures.…”