Abstract:The tracking of the cure of epoxy adhesives and the assessment of the cure state of adhesive bondlines joining engineering components are important for quality assurance during manufacture and for the safe functioning of manufactured assemblies in the field. Ultrasound can be used to give estimates of the compression modulus of curing and cured materials and thereby provide a means to assess non-destructively the cure state of adhered joints during manufacture and in service. These techniques are at present di… Show more
“…Krautkraemer and Krautkraemer [11]), including the study of the curing process [12]. Fundamental work was undertaken by Alig and coworkers [13][14][15][16][17][18][19], and Challis et al [20][21][22][23][24]. A good overview on methods for cure monitoring including ultrasound is given in Lodeiro and Mulligan [25].…”
Section: Online Process Monitoring Using Ultrasoundmentioning
“…Krautkraemer and Krautkraemer [11]), including the study of the curing process [12]. Fundamental work was undertaken by Alig and coworkers [13][14][15][16][17][18][19], and Challis et al [20][21][22][23][24]. A good overview on methods for cure monitoring including ultrasound is given in Lodeiro and Mulligan [25].…”
Section: Online Process Monitoring Using Ultrasoundmentioning
“…The measurements of velocity and attenuation dispersions are the most important factors in the monitoring of several properties such as ageing of a structure [1], viscoelastic behavior [2], polymer cure [3][4][5][6][7][8][9][10] and porosity characterization [11]. Reproducibility at normal incidence and temperature sensitivity has an important effect on dispersion acoustic parameters.…”
“…Currently a number of techniques can be used to study the cure reaction within a laboratory environment. Differential scanning calorimetry (DSC) [1], dielectric spectroscopy [2], nuclear magnetic resonance (NMR) [3], wide angle X-ray scattering (WAXS) [4] and ultrasonic spectroscopy [5] have all been used. However, arguably only the ultrasonic and dielectric techniques have the potential to be developed for cure monitoring in an industrial environment.…”
The mechanical properties of thermoset adhesive layers depend greatly on the cure conditions, such as cure temperature and duration. Ultrasonic measurements of the cure state of thermosets have been shown to be very sensitive to variations in these process conditions. In this paper a further parameter affecting the cure state of thermoset layers is considered. The thickness of an adhesive layer is shown to have a significant effect on the final properties of the thermoset. We suggest that the exothermic nature of the cure reaction is causing significant temperature gradients to occur within adhesives layers during cure leading to a variation in properties across the layer together with the possibility of decreased bondline strength.
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