2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) 2022
DOI: 10.1109/impact56280.2022.9966718
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Ultrasonic dispersion of nanocomposite solder for microelectronic packaging

Sri Harini Rajendran
1
,
Hyejun Kang
2
,
Seong Min Seo
3
et al.
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