2004
DOI: 10.1016/j.compstruct.2004.04.064
|View full text |Cite
|
Sign up to set email alerts
|

Ultrasonic consolidation for embedding SMA fibres within aluminium matrices

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1
1

Citation Types

1
76
0

Year Published

2011
2011
2021
2021

Publication Types

Select...
4
3
2

Relationship

0
9

Authors

Journals

citations
Cited by 96 publications
(77 citation statements)
references
References 10 publications
1
76
0
Order By: Relevance
“…The composites envisaged find applications in adaptive or smart structures that can monitor their condition, control, or even, heal damage and adapt to environments [75,76].…”
Section: Ultrasonic Weldingmentioning
confidence: 99%
“…The composites envisaged find applications in adaptive or smart structures that can monitor their condition, control, or even, heal damage and adapt to environments [75,76].…”
Section: Ultrasonic Weldingmentioning
confidence: 99%
“…The material was chosen due to its use in earlier UC studies on fibre embedding (Yang et al, 2010) Prior to the laser processing, samples were manufactured using Loughborough University's Alpha 2 UC machine. The machine was supplied by Solidica INC., USA and had been used in several previous UC studies (Kong, 2004;). Variable process parameters of the UC machine are: sonotrode oscillation amplitude (µm), welding speed (mm/s) and welding force (N).…”
Section: Methodsmentioning
confidence: 99%
“…A schematic overview of the process is given in Figure 1(a). Two key aspects of UC are: Firstly, bond formation is achieved at temperatures lower, (typically ≤ 50 %), than the melting temperature of the foil material (Kong, 2004). Secondly, highly localised plastic flow occurs during ultrasonic 5 excitation of the metal foil (Langenecker, 1966).…”
mentioning
confidence: 99%
“…The elastic and thermal mismatches between the oxides and the base metal help this removal process [1]. This surface cleanup process is essential for atomic bonding, which generally depends on close contact and a surface area free of oxides and contaminants available for atomic diffusion [2]. It is reported that no surface preparation prior to consolidation is necessary [3] even if a tenacious oxide layer is present.…”
Section: Introductionmentioning
confidence: 99%