Ultrasonic-Assisted Sintering of Silver Nanoparticles for Flexible Electronics

Wang, Fuliang; Nie, Nantian; He, Hu; Tang, Zikai; Chen, Zhexi; Zhu, Wenhui

doi:10.1021/acs.jpcc.7b09581

Cited by 22 publications

(15 citation statements)

References 22 publications

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“…52 The ultrasonic vibration promoted neck growth during heating at low sintering temperature. 54 As the sintering temperature rises, the significant contribution of heating rate was observed for thermal conductivity. The maximum thermal conductivity was depicted at low heating rate and at high sintering temperature.…”

Section: Resultsmentioning

confidence: 99%

Experimental investigations into mechanical and thermal properties of rapid manufactured copper parts

Singh

Pandey

2019

Proceedings of the Institution of Mechanical Engineers, Part C:

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In the present paper, mechanical and thermal properties of rapidly manufactured copper parts were studied. The combination of three-dimensional printing and ultrasonic assisted pressureless sintering was used to fabricate copper parts. First, the ultimate tensile strength and thermal conductivity were compared between ultrasonic assisted and conventional pressureless sintered samples. The homogenously mixing of particles and local heat generation by ultrasonic vibrations promoted the sintering driving process and resulted in better mechanical and thermal properties. Furthermore, response surface methodology was adopted for the comprehensive study of the ultrasonic sintering parameters (sintering temperature, heating rate, and soaking time with ultrasonic vibrations) on ultimate tensile strength and thermal conductivity of the fabricated sample. Analysis of variance was performed to identify the significant factors and interactions. The image processing method was used to identify the surface porosity at different parameter levels to analyse the experimental results. High ultimate tensile strength was obtained at high sintering temperature, long soaking time, and slow heating rate with low surface porosity. After 60 min of soaking time, no significant effect was observed on the thermal conductivity of the fabricated sample. The significant interactions revealed less effect of soaking time at low sintering temperatures for ultimate tensile strength and less effect of heating rate at low sintering temperatures for thermal conductivity. Multi-objective optimization was carried out to identify parameters for maximum ultimate tensile strength and maximum thermal conductivity.

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Section: Resultsmentioning

confidence: 99%

Experimental investigations into mechanical and thermal properties of rapid manufactured copper parts

Singh

Pandey

2019

Proceedings of the Institution of Mechanical Engineers, Part C:

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“…Therefore, it could possess large contact stresses and the high frictional thermal heat, naturally. 13,36 Consequently, it could form a large neck area or early neck growth in the experimental conditions. Also, in the present experiments, samples were introduced in the cold furnace and later, ultrasonic vibration and heating were provided as the ramp function by use of controllers to acquire sintering temperature.…”

Section: Resultsmentioning

confidence: 99%

“…In ultrasonic sintering, the cyclic contact stress was generated between the particles, which influenced higher diffusion. 13,43,44 Therefore, the contact stress was considered as cyclic in the present work and given as where Fi is the force acting between the particles and taken as avsin2, 44 f is the frequency (20 kHz), t is the vibration time as per soaking time, and av is the amplitude of the vibration (20 µm).…”

Section: Resultsmentioning

confidence: 99%

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Neck growth kinetics during ultrasonic-assisted sintering of copper powder

Singh

Pandey

2020

Proceedings of the Institution of Mechanical Engineers, Part C:

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The present paper presents an investigation of the neck growth kinetics during ultrasonic-assisted sintering of the loose spherical copper particles. The study was performed to identify the sintering mechanism during the initial stage sintering of the copper powder. The classical sphere-to-sphere approach was used to determine the neck growth between the particles at four different sintering temperatures 700, 800, 900 and 950 ℃ at different soaking time of 60, 180, 300, 600, and 900 s. The neck growth exponent was found to be 6.21, 4.92, 5.26 and 5.13 for different sintering temperatures, respectively, which signified the involvement of surface and volume diffusion mechanism during the initial stage sintering of copper particles with ultrasonic vibration assistance. The neck growth calculation was attempted to compare with conventional sintering. The evidence of the local heating between the particles was evolved from the activation energy calculations, which was found to be lower than the conventional sintering. An attempt was made to develop a numerical model for the prediction of neck growth by considering the rise in temperature due to friction between the particles owing to ultrasonic vibrations at different sintering temperature and soaking time. The model was obtained to be in-line with the trend of the experimental results.

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“…As it is well-known the sintering process is the atom diffusion driven by internal and external energies or forces. A denser microstructure would enhance the electrical conductivity, which indicates that good densification in the sintering process is a key to secure better electrical properties [33].…”

Section: Electrical Resistance Measurements Of the Wiresmentioning

confidence: 99%