Ultrashort pulse laser patterning of indium tin oxide thin films on glass by uniform diffractive beam patterns

Kuang, Zheng; Perrie, Walter; Liu, Dun; Fitzsimons, Paul; Edwardson, Stuart; Fearon, Eamonn; Dearden, Geoff; Watkins, Ken

doi:10.1016/j.apsusc.2012.04.099

Cited by 44 publications

(14 citation statements)

References 20 publications

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“…Das Bruchstück dürfte somit noch nicht von Korrosion betroffen sein. In vielen Anwendungen muss die dünne ITO-Schicht dem Anwendungszweck entsprechend mit großer Genauigkeit strukturiert werden [10]. Die schnelle und berührungslose 3D-LIBS-Technologie kann sowohl für die Mikrostrukturierung als auch für die zeitgleiche, semiquantitative Analyse der Elementzusammensetzung dün-ner Schichten genutzt werden ("spektroskopisch kontrollierter Abtragprozess").…”

Section: D-libs Bei Der Untersuchung Von Bauschädenunclassified

Schnelle Materialanalyse mit Lasern

Beresko

Dietz

Kohns

et al. 2014

Tm - Technisches Messen

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Zusammenfassung: Laseroptische Verfahren zur schnellen berührungsfreien Materialanalyse besitzen ein breites industrielles Anwendungsspektrum. Wir zeigen an ausgewählten Beispielen die Möglichkeiten der laserinduzierten Plasmaspektroskopie zur dreidimensionalen Elementanalyse (3D-LIBS) und beschreiben interessante Anwendungsfelder der Raman-Spektroskopie zur Identifikation molekularer Strukturen organischer und anorganischer Verbindungen.Schlüsselwörter: LIBS, laserinduzierte Plasmaspektroskopie, 3D-Elementanalyse, Raman-Spektroskopie, Nanopartikel-Herstellung.Abstract: Laser-optical methods for fast non-contact material analysis exhibit a wide spectrum of industrial applications. We show selected examples of the possibilities of laser-induced breakdown spectroscopy for threedimensional element analysis (3D-LIBS) and describe interesting applications of Raman spectroscopy for identifying molecular structures of organic and inorganic compounds.

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Section: D-libs Bei Der Untersuchung Von Bauschädenunclassified

Schnelle Materialanalyse mit Lasern

Beresko

Dietz

Kohns

et al. 2014

Tm - Technisches Messen

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“…It effectively supports the economic construction and social development. As an important branch of laser processing, picosecond (ps) laser precision processing is widely used in flexible circuit board manufacturing, wafer cutting, cardiovascular stents, solar cell manufacturing, and so on [1][2] . These application areas require high processing precision.…”

Section: Introductionmentioning

confidence: 99%

High-power high-efficiency picosecond 355nm ultraviolet laser based on La₂CaB₁₀O₁₉crystal

Yan

Wang

et al. 2014

SPIE Proceedings

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A high-power high efficiency picosecond (ps) 355 nm ultraviolet (UV) laser was reported based on the nonlinear optical crystal of type-I phase-matching La 2 CaB 10 O 19 (LCB) which possesses the characteristic of non-hygroscopicity. The high-power third harmonic generation was successfully achieved from a 1064 nm ps fundamental laser. The maximum output power of 7.81 W of 355 nm UV laser was obtained from 35.2 W 1064 nm ps laser (80 MHz repetition rate, 10 ps pulse width) with optical conversion efficiency of 22.2%. The experimental results show that the LCB crystal has a promising prospect in generating high-power high efficiency UV laser.

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“…Conventional laser fabrication could cause heat-affected zone and thermal defects during processing. Therefore, more recent researches aims to implement the microstructure of ITO thin films on glass by ultrshort pulse laser processing together with high repetition rate or short wavelength to avoid above defects [3,4]. The experimental results of ITO patterning on a flexible PET substrate by 1064 nm picosecond laser revealed that overlap rate less than 50% led to lower heat accumulation effect for less damage to the PET substrate and smoother ablation rim [5].…”

Section: Introductionmentioning

confidence: 99%

Selective patterning of indium tin oxide films using 1064 nm laser for micro parts processing

Chung

2014

The 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

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We report the experimental and analysis results of micro parts processing using 1064 nm Nd:YVO 4 laser direct-write micro patterning of indium tin oxide (ITO) thin films and then followed by electroforming on the patterns. Compared with conventional photolithographic and etching technologies, direct-write micropatterns of ITO using Nd:YVO 4 laser at proper control can achieve high quality of surface without requiring numerous processing steps. Using diffractive multiple Nd:YVO 4 beam, the ITO thin film could be removed without any damage to the glass structure. After laser patterning, a high overlapping area of laser spot was used to pattern the electrode layer on film surface for obtaining a fine ablated edge profile. Accordingly, the micro parts can be obtained using electroforming and release process via laser-patterned ITO films. The new micro parts processing is a maskless, dry and low-cost process instead of the complex photolithography, sputtering and sacrificial layer.

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Ultrashort pulse laser patterning of indium tin oxide thin films on glass by uniform diffractive beam patterns

Cited by 44 publications

References 20 publications

Schnelle Materialanalyse mit Lasern

Schnelle Materialanalyse mit Lasern

High-power high-efficiency picosecond 355nm ultraviolet laser based on La₂CaB₁₀O₁₉crystal

Selective patterning of indium tin oxide films using 1064 nm laser for micro parts processing

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Ultrashort pulse laser patterning of indium tin oxide thin films on glass by uniform diffractive beam patterns

Cited by 44 publications

References 20 publications

Schnelle Materialanalyse mit Lasern

Schnelle Materialanalyse mit Lasern

High-power high-efficiency picosecond 355nm ultraviolet laser based on La2CaB10O19crystal

Selective patterning of indium tin oxide films using 1064 nm laser for micro parts processing

Contact Info

Product

Resources

About

High-power high-efficiency picosecond 355nm ultraviolet laser based on La₂CaB₁₀O₁₉crystal