2010
DOI: 10.1109/ted.2010.2043311
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Ultrashallow TiC Source/Drain Contacts in Diamond MOSFETs Formed by Hydrogenation-Last Approach

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Cited by 45 publications
(22 citation statements)
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“…The conditions used for the growth of the high-quality homoepitaxial diamond film are given elsewhere in detail [27]. After cleaning in a mixture of sulfuric acid and nitric acid (3:1) at 200°C for 30 min, the diamond surface was exposed to a remote hydrogen plasma at ∼640°C for 5 min [28]. This hydrogen-termination treatment provides an electroconductive surface that prevents electrostatic charging upon EB irradiation.…”
Section: Methodsmentioning
confidence: 99%
“…The conditions used for the growth of the high-quality homoepitaxial diamond film are given elsewhere in detail [27]. After cleaning in a mixture of sulfuric acid and nitric acid (3:1) at 200°C for 30 min, the diamond surface was exposed to a remote hydrogen plasma at ∼640°C for 5 min [28]. This hydrogen-termination treatment provides an electroconductive surface that prevents electrostatic charging upon EB irradiation.…”
Section: Methodsmentioning
confidence: 99%
“…The other studies of R C at RT resulted in various values of ~110 -6 , ~110 -5 , 0.04 cm 2 [18][19][20]. Barrier heights were not evaluated in the later three studies [18][19][20].…”
Section: Accepted Manuscriptmentioning
confidence: 99%
“…For surface hydrogenation, hydrogen ambient and a relatively high temperature (500–600 °C) are essential. However, hydrogenation can be achieved by hydrogen plasma or hydrogen radicals at a temperature of less than 300 °C 8.…”
Section: Variety Of Surface Terminationsmentioning
confidence: 99%