2007
DOI: 10.2493/jjspe.73.360
|View full text |Cite
|
Sign up to set email alerts
|

Ultraprecision Machining of Tungsten Alloy by Applying Ultrasonic Elliptical Vibration Cutting

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

1
0
0

Year Published

2011
2011
2023
2023

Publication Types

Select...
5

Relationship

1
4

Authors

Journals

citations
Cited by 11 publications
(1 citation statement)
references
References 1 publication
1
0
0
Order By: Relevance
“…10(a), microchipping tends to occur at the lower boundary of the tool-workpiece contact area in the combined cutting process. A similar phenomenon is also found in elliptical vibration cutting of tungsten alloy [18]. In the present study, this phenomenon is considered to be caused by the elliptical vibration motion of the diamond tool.…”
Section: Discussionsupporting
confidence: 49%
“…10(a), microchipping tends to occur at the lower boundary of the tool-workpiece contact area in the combined cutting process. A similar phenomenon is also found in elliptical vibration cutting of tungsten alloy [18]. In the present study, this phenomenon is considered to be caused by the elliptical vibration motion of the diamond tool.…”
Section: Discussionsupporting
confidence: 49%