2022
DOI: 10.1016/j.jcis.2022.07.144
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Ultralight, highly flexible in situ thermally crosslinked polyimide aerogels with superior mechanical and thermal protection properties via nanofiber reinforcement

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Cited by 25 publications
(14 citation statements)
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“…The term aerogel is used to describe a family of open porous solids that can be fabricated from a wide variety of base materials, polymer aerogels were designed with the primary aim of developing superinsulators with good mechanical properties in a wide temperature range. [9][10][11][12] Among these materials, polyimide and polyamide aerogels have the most promising properties enabling aerospace and electronic applications. [13][14][15][16] In general, the cost of polyimide aerogels are high due to the need of expensive chemicals for synthesizing the polymer backbone.…”
Section: Introductionmentioning
confidence: 99%
“…The term aerogel is used to describe a family of open porous solids that can be fabricated from a wide variety of base materials, polymer aerogels were designed with the primary aim of developing superinsulators with good mechanical properties in a wide temperature range. [9][10][11][12] Among these materials, polyimide and polyamide aerogels have the most promising properties enabling aerospace and electronic applications. [13][14][15][16] In general, the cost of polyimide aerogels are high due to the need of expensive chemicals for synthesizing the polymer backbone.…”
Section: Introductionmentioning
confidence: 99%
“…Thermal conductivity of PIFs in the (a) vertical direction and (b) horizontal direction; (c) comparison of thermal conductivity between this work and literature values, including ANF/PI aerogel (), MXene/PI aerogel (), silica aerogel (), PI/aramid sponge (), PI/ANF aerogel (), PI foam plastic (), PI/red phosphorus/graphene foam (), MXene/ANF/PI aerogel (), PI foam (), CNTs@CoFe2O4/PI aerogel (), IBNR-PI aerogel (); (d) thermal insulation mechanism of PIFs in different directions; (e) changes of top surface temperature of PIFs in both vertical and horizontal directions; (f) infrared thermal images of PIFs [f 1 : side view (i.e., horizontal direction), f 2 : top view (vertical direction), f 3 : 3D infrared thermal images].…”
Section: Resultsmentioning
confidence: 97%
“…Globally, more than 30% energy consumption is used for daily heating and cooling, and improving energy efficiency is essential for the sustainability of society. The use of thermal insulation materials is becoming critical for protecting human bodies and maintaining proper functions of devices, especially in the fields of space, marine, and nuclear reactors, among others. Nowadays, rubber foams, polyurethane (PU) foams, and polystyrene (PS) foams are employed as thermal insulation materials; however, these materials cannot maintain their original properties when they are subjected to extreme cold/heat conditions, let alone the poor thermal stability and flammability of the above-mentioned products. Thus, it becomes imperative and challenging to develop lightweight, highly elastic thermal insulation materials, which can be targeted for ultralow/high temperature applications. , …”
Section: Introductionmentioning
confidence: 99%
“…However, this material has high density, leading to an increase in thermal conductivity. Polyimide (PI) nanofiber aerogels that combine high thermal stability and glass transition temperature with lightweight, flexible, and thermal insulation for aerospace and other applications have a great amount of interesting work which has been reported by several research groups. In previous studies, PI aerogels manufactured from different chemistries and starting monomers via an imidization process possessed large shrinkage (30–50%) during PI aerogel formation. Greiner et al manufactured PI nanofiber aerogel from poly­(amic acid) PAA and pyromellitic dianhydride via electrospinning and an imidization reaction based on the concept of “self-gluing” the fibrous network skeleton of PI during sponge formation . Thermal imidization using the protocol with the annealing specimen at high temperature caused shrinkage and setback the mechanical stability during PI aerogel formation.…”
Section: Introductionmentioning
confidence: 99%