Ultrahigh thermal and electric conductive graphite films prepared by g-C3N4 catalyzed graphitization of polyimide films

Li, Shuaizhen; Zheng, Zhibo; Liu, Siwei; Chi, Zhenguo; Chen, Xudong; Zhang, Yi; Xu, Jinliang

doi:10.1016/j.cej.2021.132530

Cited by 31 publications

(15 citation statements)

References 41 publications

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“…Moreover, natural graphite (NG) films (100–700 W (mK) −1 ) and graphitized polyimide (GPI) films (1000 [ 103 ] and 1750 W (mK) −1 [ 2 ]) with ultrahigh k have been produced from expanding graphite via compressing and graphitization of PI films at high temperatures, respectively [ 108 ]. Some polymers with high carbon yield as precursors can also be transformed into graphite structure after carbonization, a telling example is PI with dianhydride and diamine structures [ 101 , 108 ]. Under high temperature, the elements of N, H and O can escape in the form of gas from PI films [ 108 ].…”

Section: High-performance Thermally Conductive Filmsmentioning

confidence: 99%

Emerging Flexible Thermally Conductive Films: Mechanism, Fabrication, Application

et al. 2022

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Effective thermal management is quite urgent for electronics owing to their ever-growing integration degree, operation frequency and power density, and the main strategy of thermal management is to remove excess energy from electronics to outside by thermal conductive materials. Compared to the conventional thermal management materials, flexible thermally conductive films with high in-plane thermal conductivity, as emerging candidates, have aroused greater interest in the last decade, which show great potential in thermal management applications of next-generation devices. However, a comprehensive review of flexible thermally conductive films is rarely reported. Thus, we review recent advances of both intrinsic polymer films and polymer-based composite films with ultrahigh in-plane thermal conductivity, with deep understandings of heat transfer mechanism, processing methods to enhance thermal conductivity, optimization strategies to reduce interface thermal resistance and their potential applications. Lastly, challenges and opportunities for the future development of flexible thermally conductive films are also discussed.

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Section: High-performance Thermally Conductive Filmsmentioning

confidence: 99%

Emerging Flexible Thermally Conductive Films: Mechanism, Fabrication, Application

et al. 2022

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“…On the other hand, the d-spacing was 0.3419 nm for BP-P-SiCH 3 -G. The decrease in d-spacing indicated the increase in graphitization degree. 17,20,[23][24][25][26][27] The degree of graphitization was further estimated, according to the following empirical formula. 16,23,25,28 G ¼ 0:344 À d 002 0:344 À 0:3354 Â 100%…”

Section: Graphitization Degree Of Coatings On Sicmentioning

confidence: 99%

“…17,20,[23][24][25][26][27] The degree of graphitization was further estimated, according to the following empirical formula. 16,23,25,28 G ¼ 0:344 À d 002 0:344 À 0:3354 Â 100%…”

Section: Graphitization Degree Of Coatings On Sicmentioning

confidence: 99%

Polyimide-derived graphite barrier layer adhered to seed crystals to improve the quality of grown silicon carbide

Tsai

Wang

et al. 2022

RSC Adv.

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“…With the rapid development of electronic devices, the fast speed and high frequency of signal transmission inevitably cause a large amount of heat release at high thermal density, which generates a high requirement for efficient thermal conductivity materials within these electronic devices [1,2]. In recent years, carbon materials with a variety of allotropes have attracted much attention in the field of heat management due to their remarkable thermal conductivity (λ) properties in comparison with other materials [3,4].…”

Section: Introductionmentioning

confidence: 99%

“…In order to obtain a complete and high orientation structure of graphite film with outstanding thermal conductivity, the composition and characteristics of the monomer structure of the starting PI, as well as the pyrolytic graphitization process, are particularly important [26]. Some studies have focused on the catalytic carbonization and graphitization of PI film by the introduction of nickel [27], SiC [28], g-C 3 N 4 [2], and pyridine [29]. Other research has managed to improve the thermal conductivity of precursor PI film via the addition of thermally conductive fillers, such as BN [30] and CN nanosheets [31].…”

Section: Introductionmentioning

confidence: 99%

Highly Thermal Conductive Graphite Films Derived from the Graphitization of Chemically Imidized Polyimide Films

Sun

Wang

et al. 2022

Nanomaterials

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With the large-scale application and high-speed operation of electronic equipment, the thermal diffusion problem presents an increasing requirement for effective heat dissipation materials. Herein, high thermal conductive graphite films were fabricated via the graphitization of polyimide (PI) films with different amounts of chemical catalytic reagent. The results showed that chemically imidized PI (CIPI) films exhibit a higher tensile strength, thermal stability, and imidization degree than that of purely thermally imidized PI (TIPI) films. The graphite films derived from CIPI films present a more complete crystal orientation and ordered arrangement. With only 0.72% chemical catalytic reagent, the graphitized CIPI film achieved a high thermal conductivity of 1767 W·m−1·K−1, which is much higher than that of graphited TIPI film (1331 W·m−1·K−1), with an increase of 32.8%. The high thermal conductivity is attributed to the large in-plane crystallite size and high crystal integrity. It is believed that the chemical imidization method prioritizes the preparation of high-quality PI films and helps graphite films achieve an excellent performance.

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Ultrahigh thermal and electric conductive graphite films prepared by g-C3N4 catalyzed graphitization of polyimide films

Cited by 31 publications

References 41 publications

Emerging Flexible Thermally Conductive Films: Mechanism, Fabrication, Application

Emerging Flexible Thermally Conductive Films: Mechanism, Fabrication, Application

Polyimide-derived graphite barrier layer adhered to seed crystals to improve the quality of grown silicon carbide

Highly Thermal Conductive Graphite Films Derived from the Graphitization of Chemically Imidized Polyimide Films

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