“…This surface treatment improves the open circuit voltage ( V OC ) and fill factor (FF) of the device. ,− Depending on the deposition technique, several mechanisms have been proposed for the efficiency enhancement, which can be broadly classified into two categories(a) influence on growth kinetics that leads to different grain sizes, smoother texture, and suppression of defect formation − and (b) improvement of electronic properties by removal of deleterious donor states and introduction of acceptor states, which in turn increases the net hole concentration and hence p-type conductivity. ,, In addition, Na is reported to passivate grain boundary defects and reduce minority carrier traps. , However, the exact reason for such efficiency enhancement remains under debate. One of the reasons behind this is the lack of suitable surface-sensitive characterization techniques that can observe charge carrier dynamics in real time, precisely on the surface, as it is well-known that Na is mostly localized onto the surface of CIGSe, rather than in the bulk of the film. ,,,, The structural changes on the surface post Na incorporation can be verified following several microscopic and spectroscopic characterization techniques; however, its effects on modifying the electronic properties of CIGSe have only been inferred from the device measurements or predicted from theoretical calculations. − Spectroscopic studies have also been reported to understand the effect of Na on charge carrier dynamics; however, because of the large penetration depth of the laser beam, these studies provide the dynamical information mainly from the bulk of the material rather than the surface. , …”