Advances in silicon photonics have resulted in rapidly increasing complexity in integrated circuits. New methods that allow the direct characterization of individual optical components in situ, without the need for additional fabrication steps or test structures, are desirable. Here, we present a device-level method for the characterization of photonic chips based on a highly localized modulation in the device using pulsed laser excitation. Optical pumping perturbs the refractive index of silicon, providing a spatially and temporally localized modulation in the transmitted light, enabling time-and frequencyresolved imaging. We demonstrate the versatility of this all-optical modulation technique in imaging and in the quantitative characterization of a range of properties of silicon photonic devices, from group indices in waveguides, to quality factors of a ring resonator, and to the mode structure of a multimode interference device. Ultrafast photomodulation spectroscopy provides important information on devices of complex design, and is easily applicable for testing at the device level. I ntegrated silicon-based photonics has developed into a mature technology platform with a multitude of applications 1-4 , including telecommunications, healthcare diagnostics and optical sensors. As the technology progresses, device designs are becoming increasingly complex, with more functions integrated onto a single device 5 . The characterization of fabricated devices is an important step in the design cycle as it highlights differences between the intended design and the fabricated device, thus allowing the optimization of fabrication steps as well as of the entire design process. Established technologies, such as scanning electron microscopy (SEM), atomic force microscopy (AFM) and ellipsometry, are able to precisely measure device footprints, waveguide cross-sections, surface and sidewall roughness, film thickness and other geometric parameters.Direct access to the properties of light propagation in waveguide devices has proven more challenging, but numerous methods for the analysis of integrated optic elements have been proposed. Among them are reflectometry methods 6-9 , far-field scattering microscopy 10-13 , as well as the interrogation of structures with electron beams (cathodoluminescence) 14 , near-field optical probes 14-16 and AFM tips 17-23 . Near-field scanning optical microscopy (NSOM) is a powerful technique that gives direct access to light propagation, including phase information, and has high spatial resolution 15,16,24,25 . The drawbacks of scanning probe microscopy are its small field of view, slow scanning speeds and limited reproducibility and durability of the tips. Moreover, near-field techniques require direct access to the waveguide surface in order to interact with evanescent field components, limiting the analysis of devices covered with a top cladding for protection and stability.Here, we present a new approach for the characterization of silicon-on-insulator (SOI) waveguide elements at the devic...