2007
DOI: 10.1126/science.1145220
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Ultrafast Flash Thermal Conductance of Molecular Chains

Abstract: At the level of individual molecules, familiar concepts of heat transport no longer apply. When large amounts of heat are transported through a molecule, a crucial process in molecular electronic devices, energy is carried by discrete molecular vibrational excitations. We studied heat transport through self-assembled monolayers of long-chain hydrocarbon molecules anchored to a gold substrate by ultrafast heating of the gold with a femtosecond laser pulse. When the heat reached the methyl groups at the chain en… Show more

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Cited by 418 publications
(571 citation statements)
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“…3b. This value is comparable with direct measurements of thermal conductance through a planar alkanethiol-SAM/Au interface (220 ± 100 MW m −2 K −1 ) 16 . SAM junctions 9,17 have a lower measured thermal conductance (25-70 MW m −2 K −1 ) because they include additive resistances due to the SAM itself and two interfaces.…”
supporting
confidence: 75%
“…3b. This value is comparable with direct measurements of thermal conductance through a planar alkanethiol-SAM/Au interface (220 ± 100 MW m −2 K −1 ) 16 . SAM junctions 9,17 have a lower measured thermal conductance (25-70 MW m −2 K −1 ) because they include additive resistances due to the SAM itself and two interfaces.…”
supporting
confidence: 75%
“…This phenomenon was observed first at the interface of a metal and liquid helium [243], while later it has been found at the interface of two solids [244]. The heat loss at the interface of two different materials is due to the phonon scattering at this region [236,238,239]. Phonon scattering can be significantly impacted by dimensions of fillers, the matrix, and their interfacial regions.…”
Section: Thermal Conductivitymentioning
confidence: 98%
“…In many literatures, it has been confirmed that the interface in the composites play a significant role in their thermal conductivity [236][237][238][239][240][241]. Heat transfer at the interface of two different materials mostly happens with a temperature discontinuity [242].…”
Section: Thermal Conductivitymentioning
confidence: 99%
“…Losego et al 6 demonstrated a link between interfacial bonding characters and thermal conductance at the atomic level. However, the processes of heat dissipation and transport in molecular junctions still remain poorly understood 3,6,[24][25][26][27] , which prohibits continuously growing development of aforementioned applications.…”
mentioning
confidence: 99%