Ultrafast fabrication of rough structures required by superhydrophobic surfaces on Al substrates using an immersion method

Effect of coupling agent on surface free energy of organic modified attapulgite (OAT) powders and tensile strength of OAT/ethylene-propylene-diene monomer rubber nanocomposites

“…According to thermodynamic theory, the values of free energy of immersion decreased with the increase of wettability of fillers, thus leading to better dispersibility and reinforcement of fillers in rubber [25][26][27]. However, the trend illustrated in the tensile strength and free energy of immersion for two types of coupling agent with different content graphs (Fig.…”

Rapid fabrication and characterization of superhydrophobic tri-dimensional Ni/Al coatings

“…7. The five absorption peaks at around 530, 599, 950, 1117 and 1207 cm −1 were detected assigned to the stretching vibration of C F bonds in the form of CF, CF 2 , or CF 3 [24,[28][29][30]. According to the assembly mechanism analysis in Fig.…”

A facile solution-immersion process for the fabrication of superhydrophobic gibbsite films with a binary micro-nano structure: Effective factors optimization via Taguchi method

“…There is not any requirement of special and complicated equipment. Moreover the chemical reactions are performed at low temperatures [15]. There are some important factors which affect the hydrophobicity of the solution immersion fabricated thin films.…”

“…Wettability of a surface can be determined by measuring the contact angle of a water droplet, WCA, and contact angle hysteresis, CAH [7][8][9][10][11]. When the WCA value is greater than 150 , and the amount of CAH is less than 10° the examined surface is called super-hydrophobic [12][13][14][15][16]. Generally, the surface of metals due to high surface energy and intrinsic hydrophilicity is exposed to many environmental contaminants [14].…”

“…Up to now, artificial superhydrophobic surfaces have been fabricated by various techniques, such as sol-gel method [20], hydrothermal [7], chemical etching [21], Anodizing [22], chemical vapor deposition [23], electrochemical deposition [17], layer-by-layer assembly [8], solution immersion method [6,15,19,24], and etc. Apart from the last one, other processes are almost complex, time-consuming, elaborating and requiring expensive equipment.…”