Ultra-thin thermally grown silicon dioxide nanomembrane for waterproof perovskite solar cells

Cho, Myeongki; Jeon, Gyeong G.; Sang, Mingyu; Kim, Tae Soo; Suh, Jungmin; Shin, So Jeong; Choi, Min Jun; Kim, Hyun Woo; Kim, Kyubeen; Lee, Ju Young; Noh, Jeong Yeon; Kim, Jong H.; Kim, Jin-Cheol; Park, Nochang

doi:10.1016/j.jpowsour.2023.232810

Cited by 5 publications

(6 citation statements)

References 62 publications

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“…Transformed by the Arrhenius equation, at pH 7.4, and 37 • C the dissolution rate of SiO 2 is 4 × 10 −2 nm•d −1 , indicating an exceptionally long lifespan of around 70 years [128]. Also, t-SiO 2 with a very low water transmission rate of 1.53 × 10 −3 g•m −2 •d −1 at 85 • C and 500 nm thickness which significantly increases the lifespan even in harsh environments, can serve as an excellent encapsulation layer [277]. Consequently, the substrate removal etching process enables to use of single-crystalline Si without deformation and t-SiO 2 as an encapsulation layer, which not only extends the lifespan of the flexible electronics but also allows to maintain performance even in harsh environments.…”

Section: Substrate Removal Etchingmentioning

confidence: 99%

“…In the process of bonding the SOI wafer and the flexible substrate, the buffer layer serves a crucial role in the aspect of structural defects. The buffer layer prevents cracks in the t-SiO 2 layers caused by Young's modulus difference during the Si etching process [277]. Generally, materials with Young's modulus in the GPa range similar to t-SiO 2 , such as PI, are used to prevent these cracks [279,280].…”

Section: Substrate Removal Etchingmentioning

confidence: 99%

“…Therefore, the CMP process, which is used in fabrication to smooth and planarize the surface of the wafer, is applied to polish the back surface of the SOI wafer. This process is aimed at the mirror-like surface of the substrate before the DRIE process, ensuring uniform etching depth, and reducing the heat applied to the sample during the process by decreasing the process time [277]. At this time, due to the selective etching properties between Si and SiO 2 , the SiO 2 layer in the SOI wafer serves as an etch-stop layer [287,288].…”

Section: Substrate Removal Etchingmentioning

confidence: 99%

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Novel fabrication techniques for ultra-thin silicon based flexible electronics

Lee,

Ju,

Lee

et al. 2024

Int. J. Extrem. Manuf.

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Flexible electronics offer a multitude of advantages, such as flexibility, lightweight properties, portability, and high durability. These unique properties allow for seamless applications to curved and soft surfaces, leading to extensive utilization across a wide range of fields in consumer electronics. These applications, for example, span integrated circuits, solar cells, batteries, wearable devices, bio-implants, soft robotics, and biomimetic applications. Recently, flexible electronic devices have been developed using a variety of materials such as organic, carbon-based, and inorganic semiconducting materials. Silicon (Si) owing to its mature fabrication process, excellent electrical, optical, thermal properties, and cost-efficiency, remains a compelling material choice for flexible electronics. Consequently, the research on ultra-thin Si in the context of flexible electronics is studied rigorously nowadays. The thinning of Si is crucially important for flexible electronics as it reduces its bending stiffness and the resultant bending strain, thereby enhancing flexibility while preserving its exceptional properties. This review provides a comprehensive overview of the recent efforts in the fabrication techniques for forming ultra-thin Si using top-down and bottom-up approaches and explores their utilization in flexible electronics and their applications.

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Section: Substrate Removal Etchingmentioning

confidence: 99%

Section: Substrate Removal Etchingmentioning

confidence: 99%

Section: Substrate Removal Etchingmentioning

confidence: 99%

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Novel fabrication techniques for ultra-thin silicon based flexible electronics

Lee,

Ju,

Lee

et al. 2024

Int. J. Extrem. Manuf.

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“…This projection may have been somewhat optimistic, as subsequent studies showed dissolution rates consistent with a lifespan of around 10.5 years for a film of the same thickness [224]. Still, there is no doubt that transferred t-SiO 2 films and material systems incorporating them demonstrate remarkably long predicted lifetimes and good barrier performance [216,221,225]. Silicon carbide (SiC), specifically amorphous silicon carbide (a-SiC), has also made waves in recent years due to its outstanding barrier properties and chemical stability, but physical transfer is also sometimes necessary due to a relatively high deposition temperature (typically > 300 • C, compatible with only highly thermally stable polymers such as polyimides).…”

Section: Inorganic Thin Filmsmentioning

confidence: 99%

Lifetime engineering of bioelectronic implants with mechanically reliable thin film encapsulations

Niemiec,

Kim

2023

Prog. Biomed. Eng.

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While the importance of thin form factor and mechanical tissue biocompatibility has been made clear for next generation bioelectronic implants, material systems meeting these criteria still have not demonstrated sufficient long-term durability. This review provides an update on the materials used in modern bioelectronic implants as substrates and protective encapsulations, with a particular focus on flexible and conformable devices. We review how thin film encapsulations are known to fail due to mechanical stresses and environmental surroundings under processing and operating conditions. This information is then reflected in recommending state-of-the-art encapsulation strategies for designing mechanically reliable thin film bioelectronic interfaces. Finally, we assess the methods used to evaluate novel bioelectronic implant devices and the current state of their longevity based on encapsulation and substrate materials. We also provide insights for future testing to engineer long-lived bioelectronic implants more effectively and to make implantable bioelectronics a viable option for chronic diseases in accordance with each patient’s therapeutical timescale.

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“…In studies on the encapsulation structure design of UV-curable resin sealed PSCs, the stacking or blending of resin with other materials was proven to be effective approach. For example, Cho et al [144] developed a three-layer encapsulation structure for PSCs with a SiO 2 waterproof layer in which UV-curable epoxy resin (SU-8) was spin-coated and cured as a buffer layer between the SiO 2 nanomembrane and silicone adhesive (Figure 9b). With a Young's modulus of approximately 4 GPa, UV-curable epoxy resin provided a stable connection between the upper and lower layers with disparate Young's moduli.…”

Section: Uv-curable Resin Used As Encapsulation Materialsmentioning

confidence: 99%

Recent Advances in UV-Cured Encapsulation for Stable and Durable Perovskite Solar Cell Devices

Cao,

Ji,

Chao

et al. 2023

Polymers

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The stability and durability of perovskite solar cells (PSCs) are two main challenges retarding their industrial commercialization. The encapsulation of PSCs is a critical process that improves the stability of PSC devices for practical applications, and intrinsic stability improvement relies on materials optimization. Among all encapsulation materials, UV-curable resins are promising materials for PSC encapsulation due to their short curing time, low shrinkage, and good adhesion to various substrates. In this review, the requirements for PSC encapsulation materials and the advantages of UV-curable resins are firstly critically assessed based on a discussion of the PSC degradation mechanism. Recent advances in improving the encapsulation performance are reviewed from the perspectives of molecular modification, encapsulation materials, and corresponding architecture design while highlighting excellent representative works. Finally, the concluding remarks summarize promising research directions and remaining challenges for the use of UV-curable resins in encapsulation. Potential solutions to current challenges are proposed to inspire future work devoted to transitioning PSCs from the lab to practical application.

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Ultra-thin thermally grown silicon dioxide nanomembrane for waterproof perovskite solar cells

Cited by 5 publications

References 62 publications

Novel fabrication techniques for ultra-thin silicon based flexible electronics

Novel fabrication techniques for ultra-thin silicon based flexible electronics

Lifetime engineering of bioelectronic implants with mechanically reliable thin film encapsulations

Recent Advances in UV-Cured Encapsulation for Stable and Durable Perovskite Solar Cell Devices

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