Ultra-Thin Multilayer Circuits

Saari, M.; Anderson, Dave; Myers, Carol

doi:10.4271/940370

Cited by 1 publication

(1 citation statement)

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“…As the number of inputs/outputs (I/O's) on a chip increases, the amount of wiring required to interconnect the chip increases. However, the size of electronic devices continue to shrink by increasing the number of signal planes and the wiring density [3]- [7], reducing line widths [3]- [7], and introducing smaller holes and vias [8], [9]. Sequential build-up technologies in fabrication have been rapidly developing to achieve such high density multilayer printed circuit boards, PCB's [10]- [18].…”

Section: Introductionmentioning

confidence: 99%

Plating of small blind vias [multilayer PCBs]

Kou

Hung

1999

IEEE Trans. Electron. Packag. Manufact.

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Metallization of laminates with blind vias on the dielectric side was performed by electroless copper plating with subsequent copper electroplating. The vertical cross section of blind vias with diameters between 125 and 75 m were analyzed by reflective microscopy. Results indicate that ultrasonic vibration during the pretreatment processes of metallization enables complete electroless copper deposition of the inside wall of the small blind vias without any voids. Furthermore, the introduction of periodic pulse reversal current for the subsequent copper electroplating process resulted in high throwing power deposition. By employing these two protocols, it has been demonstrated that high throwing power deposition can be readily achieved for blind vias as small as 75 m in diameter with an aspect ratio of 3:1.

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