Ultra-thin Image Sensor Chip Embeded Foil

Wang, S.; Albrecht, Björn; Harendt, Christine; Spuntrup, J. D. Schulze; Burghartz, Joachim N.

doi:10.1109/fleps51544.2021.9469747

Cited by 4 publications

(2 citation statements)

References 10 publications

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“…In order to achieve good homogeneity of the polymer layer and good interconnection of the chips, certain requirements regarding cavity depth, process tolerance, and a material filling in cavity trenches under the action of capillary force should and can be approached. In this case, 12 μm cavity depth and 40 μm distance between the cavity side and the chip edge were determined as the optimum [11]. The chips are then embedded by PI and BCB coatings, followed by structuring using a laser direct writer (VPG400, Heidelberg Instruments) and plasma etching with CF 4 and O 2 (PlasmalabSystem100, Oxford Instruments).…”

Section: Chip-film Patch Processmentioning

confidence: 99%

“…The system presented in this paper operates at around 5.5 GHz; it consists of a single chip, which has been thinned down to about 40 μm, and an antenna, all embedded into a thin foil (thickness 50 μm). It is worth to note that the thinned chips are mechanically flexible and can be embedded into the foil using advanced technology [10][11][12]. The integration of RF amplifier and antenna within the foil has been demonstrated in [13].…”

Section: Introductionmentioning

confidence: 99%

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Adaptive triple-fed antenna and thinned RF-chip integration into ultra thin flexible polymer foil

Fischer

Özbek

Wang

et al. 2023

Int. J. Microw. Wireless Technol.

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Attaching a wireless transmission system comprising a radio frequency (RF)-chip and a dipole antenna to dielectric material of largely different permittivity leads to strong variation of the antenna feed impedance. Due to the severe impedance mismatch between the RF-chip and the antenna, the performance of the system may deteriorate drastically. The proposed antenna provides three feed points, which show respective feed-point match to 100 Ohm balanced feeds for three different dielectric environments (free-space and half-spaces of permittivity 4 and 42, respectively). Thereby, the RF-chip incorporates three 100 Ohm balanced output ports that are connected to the antenna from whom only one can be selected to provide the output signal. The respective other two output ports are shorted by an internal switching circuit that is controlled by external DC voltages. The measurement of the reflection coefficient of the stand-alone antenna and the chip agree well with the simulations, allowing to interconnect these two components. Further, the radiation pattern of the whole system is measured for two different scenarios showing good functionalities.

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Section: Chip-film Patch Processmentioning

confidence: 99%