Ultra-thin films and surface alloying of Pd on Cu(111) investigated by medium energy ion scattering

Howe, Christopher J.; Cropper, Michael D.; Fleming, Thomas P.; Wardle, R.; Bailey, Paul; Noakes, T.C.Q.

doi:10.1016/j.susc.2009.11.007

Cited by 10 publications

(9 citation statements)

References 20 publications

(32 reference statements)

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“…The mechanical properties of NMM are strongly dependent on the interfacial structure between adjacent individual layers [ 11 ]. Howe et al investigated the interfacial structure of Pd films on Cu(111) and found that the Pd grows in a twinned FCC structure along 〈111〉 direction [ 12 ]. The twinning structures at the interface usually have a profound effect on their strength [ 11 ].…”

Section: Introductionmentioning

confidence: 99%

“…Whether these jog dislocations can form in a twin interface film with a high mismatch is still unknown. The Cu/Pd multilayered film is the earliest found multilayered film having excellent mechanical properties [ 8 , 12 , 26 – 28 ]. Its lattice mismatch (~ 7.07%) is larger than that of Cu/Ni multilayered films (~ 2.7%).…”

Section: Introductionmentioning

confidence: 99%

“…Therefore, the strengthening and weakening mechanism [ 7 , 14 – 17 ] obtained by the Cu/Ni multilayered film may not be applied to the Cu/Pd multilayered film. Two common interfaces [ 3 ], twin and cube-on-cube interface, are observed in Cu/Pd multilayered film by experimental characterization [ 12 ]. Understanding the effect of interfacial structure on multilayered films' mechanical properties would be significant for designing high-performance nano-multilayer films with a large lattice mismatch.…”

Section: Introductionmentioning

confidence: 99%

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Effects of Anisotropy and In-Plane Grain Boundary in Cu/Pd Multilayered Films with Cube-on-Cube and Twinned Interface

et al. 2021

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In crystalline materials, grain boundary and anisotropy of crystal structure affect their mechanical properties. The effects of interfacial structure on the mechanical properties may be diverse when the multilayer film is loaded along different directions. In this work, we performed a series of molecular dynamics simulations of the tension of in-plane single and polycrystalline Cu/Pd multilayered films with cube-on-cube (COC) and twinned interfaces to explore the effects of the interfacial structure, loading direction and in-plane grain boundaries on their mechanical properties. The interfacial misfit dislocation lines become bent after relaxation, and the high temperature of 300 K was found as a necessary condition. When stretched along 〈110〉 direction, the strengthening effect of the COC interface is more noticeable; however, when stretched along 〈112〉 direction, the twin interface's strengthening effect is more visible, showing the anisotropic effect of interfacial structure on mechanical properties. However, in the in-plane honeycomb polycrystalline sample, the twin interface showed a pronounced strengthening effect, and no jogged dislocations were observed.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Effects of Anisotropy and In-Plane Grain Boundary in Cu/Pd Multilayered Films with Cube-on-Cube and Twinned Interface

et al. 2021

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“…Previously, MEIS has been shown to be a valuable technique for the investigation of metal-on-metal systems and surface alloying [10,18,19,20,21]. It may be used to determine surface structures by a shadowing and blocking approach, giving layer-by-layer composition [22] and structural parameters with high accuracy [23,24].…”

Section: Introductionmentioning

confidence: 99%

The structure formed by the deposition of a sub-monolayer quantity of platinum onto Cu(110) investigated using medium energy ion scattering

et al. 2011

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“…MEIS is a surface sensitive version of Rutherford backscattering that has previously been shown to be useful in the investigation of metal-on-metal epitaxy and surface alloying [9,10,11,12,13]. It may be used to investigate surface structure via a shadowing and blocking approach.…”

Section: Introductionmentioning

confidence: 99%

Stacking faults in ultra-thin films of silver on Al(111) investigated by medium energy ion scattering

et al. 2010

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Medium energy ion scattering has been used to investigate depositions of 0.2, 1.4, 3.5 and 4.8 ML of silver onto Al(111). Energy profiles indicate alloying to the extent that aluminium is still visible after the deposition of 4.8 ML. From assessments of the visibility, blocking dips and fits using VEGAS simulations it is shown that the first two layers continue the fcc stacking but after that hcp and fcc twin-type stacking faults occur. The 1.4 ML structure is consistent with a mixed structure of 85% fcc and 15% hcp indicating that some silver occupies a third layer. The blocking curve from the structure formed by 3.5 ML equivalent deposition can be simulated by 56% fcc, 32% hcp and 12% fcc twin and that from 4.8 ML by 59% fcc, 23% hcp and 18% fcc twin. This provides direct evidence of the incidence of hcp stacking when silver is deposited onto Al(111) in the range between 2 and 5 ML.

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Ultra-thin films and surface alloying of Pd on Cu(111) investigated by medium energy ion scattering

Cited by 10 publications

References 20 publications

Effects of Anisotropy and In-Plane Grain Boundary in Cu/Pd Multilayered Films with Cube-on-Cube and Twinned Interface

Effects of Anisotropy and In-Plane Grain Boundary in Cu/Pd Multilayered Films with Cube-on-Cube and Twinned Interface

The structure formed by the deposition of a sub-monolayer quantity of platinum onto Cu(110) investigated using medium energy ion scattering

Stacking faults in ultra-thin films of silver on Al(111) investigated by medium energy ion scattering

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