Microscale Heat Transfer Fundamentals and Applications
DOI: 10.1007/1-4020-3361-3_17
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Ultra — Thin Film Evaporation (UTF) — Application to Emerging Technologies in Cooling of Microelectronics

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Cited by 6 publications
(4 citation statements)
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“…Moores and Joshi [14] experimentally studied the influence of tip clearances on pressure drop performance and heat transfer characteristics and showed that the influence of tip clearance on pressure drop performance was greatest at Re < 5 × 10 3 . Ohadi et al [15] provided an overview of several thermal management techniques that could serve as effective means to cool the next-generation high flux electronics. These include immersion cooling, jet impingement and spray cooling, and ultra-thin-film evaporation (UTF), particularly to serve at the chip level for hot spot cooling.…”
Section: Introductionmentioning
confidence: 99%
“…Moores and Joshi [14] experimentally studied the influence of tip clearances on pressure drop performance and heat transfer characteristics and showed that the influence of tip clearance on pressure drop performance was greatest at Re < 5 × 10 3 . Ohadi et al [15] provided an overview of several thermal management techniques that could serve as effective means to cool the next-generation high flux electronics. These include immersion cooling, jet impingement and spray cooling, and ultra-thin-film evaporation (UTF), particularly to serve at the chip level for hot spot cooling.…”
Section: Introductionmentioning
confidence: 99%
“…However, in these systems liquid-vapor instabilities during phase-change lead to local dry-out, non-uniform temperature distributions, and significant decreases in critical heat flux [5][6][7][8][9] . In contrast, two-phase jet impingement techniques have been investigated to a much lesser extent, despite the theoretical promise of very high heat transfer coefficients (>100 W/cm 2 K) with high heat dissipation capability (>1000 W and >1000 W/cm 2 ) via thin film evaporation 2,10 . Previous experimental attempts have typically led to pool boiling due to chamber flooding, or liquid dry-out due to insufficient liquid supply 2, 11 .…”
Section: Introductionmentioning
confidence: 94%
“…Compared with the experimental results, the numerical predictions were in reasonable agreement with the experiments. Ohadi et al [16] overviewed several thermal management techniques that could serve as an effective means to cool the next generation high flux electronics. These included the immersion cooling, jet impingement and spray cooling, and ultra thin film evaporation (UTF), particularly to serve at the chip level for hot spot cooling of the chip.…”
Section: Introductionmentioning
confidence: 99%