Ultra-small pressure sensors fabricated using a scar-free microhole inter-etch and sealing (MIS) process

Jiao, Ding; Ni, Zao; Wang, Jiachou; Li, Xinxin

doi:10.1088/1361-6439/ab8909

Cited by 15 publications

(12 citation statements)

References 20 publications

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“…Thus, a very dense array of pressure sensors is required to measure the pulse width. To achieve high-resolution pulse signal measurement, we used ultra-small absolute pressure sensors for the pulse sensor array, which were previously developed by our research group [ 43 ]. Herein, the sensor is absolute pressure sensor, which consists of a very thin but uniform polysilicon diaphragm beneath a bulk-silicon beam-island structure.…”

Section: Design and Fabrication Of Arterial Pulse Acquisition Systemmentioning

confidence: 99%

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Three-Dimensional Arterial Pulse Signal Acquisition in Time Domain Using Flexible Pressure-Sensor Dense Arrays

et al. 2021

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In this study, we developed a radial artery pulse acquisition system based on finger-worn dense pressure sensor arrays to enable three-dimensional pulse signals acquisition. The finger-worn dense pressure-sensor arrays were fabricated by packaging 18 ultra-small MEMS pressure sensors (0.4 mm × 0.4 mm × 0.2 mm each) with a pitch of 0.65 mm on flexible printed circuit boards. Pulse signals are measured and recorded simultaneously when traditional Chinese medicine practitioners wear the arrays on the fingers while palpating the radial pulse. Given that the pitches are much smaller than the diameter of the human radial artery, three-dimensional pulse envelope images can be measured with the system, as can the width and the dynamic width of the pulse signals. Furthermore, the array has an effective span of 11.6 mm—3–5 times the diameter of the radial artery—which enables easy and accurate positioning of the sensor array on the radial artery. This study also outlines proposed methods for measuring the pulse width and dynamic pulse width. The dynamic pulse widths of three volunteers were measured, and the dynamic pulse width measurements were consistent with those obtained by color Doppler ultrasound. The pulse wave velocity can also be measured with the system by measuring the pulse transit time between the pulse signals at the brachial and radial arteries using the finger-worn sensor arrays.

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Section: Design and Fabrication Of Arterial Pulse Acquisition Systemmentioning

confidence: 99%

“…(Reproduced with permission from Ref. [ 43 ] provided by IOP Publishing, Ltd, United Kingdom of Great Britainand Northern Ireland).…”

Section: Figurementioning

confidence: 99%

Three-Dimensional Arterial Pulse Signal Acquisition in Time Domain Using Flexible Pressure-Sensor Dense Arrays

et al. 2021

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“…In order to completely solve the multiple contradictions and problems mentioned above, a novel single-chip high-temperature pressure sensor with ultra-small size, high performance and low fabrication-cost is proposed in this study. The sensors are designed with a very small chip-size of 0.5 mm × 0.5 mm and fabricated in single-layer (111)silicon SOI wafers by using our group developed thin-film under bulk (TUB-silicon) process [16] to construct a beamisland reinforced diaphragm for achieving both high sensitivity and low nonlinearity. In the following sections, detailed description about design, fabrication and testing results of the high-temperature pressure sensor will be elaborated as follows.…”

Section: Introductionmentioning

confidence: 99%

Ultra-small high‐temperature pressure sensor chips fabricated in single‐layer (111) SOI wafers

Chen

Sun

et al. 2023

J. Micromech. Microeng.

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This paper presents a 0.5mm × 0.5mm tiny-sized high-temperature piezoresistive pressure sensor fabricated with a TUB (thin-film under bulk) single-sided micromachining process from the front-side of single-layer (111) SOI wafer. The (111)-device layer of the SOI wafer is specifically selected to optimize the piezoresistor performance where the SiO2 buried layer isolates the piezoresistors from the handle substrate. And the (111)-handle layer is employed to subtly construct a single-crystalline-silicon beam-island combining with a very thin but uniform poly-silicon diaphragm for realization of both low nonlinearity and high sensitivity. Without double-sided micromachining process and wafer bonding used, a tiny sensor-chip size of 0.5mm × 0.5mm is achieved, which is required in wind-tunnel systems for measuring pressure distribution at high temperature. The testing results of the fabricated sensor show high sensitivity of 0.15mV/V/kPa for 150-kPa measure range and satisfactory linearity of ±0.11%FS at ambient temperature. At 350℃, the overal accuracy is 0.17%·FS and the thermal hysteresis is 0.22%·FS. The TCO (temperature coefficient of zero-point offset) of the sensor is tested as low as 0.01%/℃·FS and the TCS (temperature coefficient of sensitivity) is -0.07%/℃·FS within the whole temperature range from -55℃ to 350℃. Featuring the advantages of high accuracy and high-yield low-cost fabrication, the tiny-sized high-temperature pressure sensors exhibit promising perspective in the field of aerospace industry including wind-tunnel application.

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“…Silicon has been widely used in the fabrication of highperformance MEMS pressure sensors [33][34][35][36]. It has high and stable Young's modulus (∼160 GPa, about 100 times that of most polymers [37]), much larger piezoresistive sensitivity (dozens of times higher than the strain sensitivity of most metals [38]) and better fabrication compatibility with the semiconductor process.…”

Section: Introductionmentioning

confidence: 99%

Flexible pressure/temperature sensors with heterogeneous integration of ultra-thin silicon and polymer

Feng,

Li,

Zhang

et al. 2023

J. Micromech. Microeng.

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Flexible pressure sensors and temperature sensors are widely used in various fields because of their advantages in high flexibility, good shape retention and extremely small thickness. However, it is quite challenging to fabricate ultra-thin flexible pressure sensors with reliable sensing performance. In this work, we propose a new type of silicon-polymer heterogeneously integrated MEMS flexible sensor with an ultra-thin silicon-based absolute pressure sensing element and a thermistor. In the study, a flexible MEMS fabrication process is developed, which enables simultaneous fabrication in two different substrates and self-release of the thin and slim flexible sensor. The front-end section of the flexible sensor is with the width as 125 μm, length as 3.2 cm and total thickness as 12 μm, where the integrated silicon substrate thickness is only 3 μm. The sensor takes a slender shape to allow for medical invasive measurement by inserting it into a slim medical catheter or a syringe needle-tube. The sensitivity of the fabricated ultra-thin absolute pressure sensor is tested as 45.2 μV/kPa under 3.3 V supplied voltage, with the nonlinearity as only ±0.16% FS. The sensitivity of the thermistor is 10.4 Ω/°C in the range of 0 °C to 100 °C. Moreover, the polysilicon thermistor can also serve as a micro-heater, where an electric heating power of 107 μW results in a temperature increase of 13.5 °C. With ultra-thin slim structure and satisfactory performance, the MEMS flexible sensor is promising in various fields like biomedical applications.

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Ultra-small pressure sensors fabricated using a scar-free microhole inter-etch and sealing (MIS) process

Cited by 15 publications

References 20 publications

Three-Dimensional Arterial Pulse Signal Acquisition in Time Domain Using Flexible Pressure-Sensor Dense Arrays

Three-Dimensional Arterial Pulse Signal Acquisition in Time Domain Using Flexible Pressure-Sensor Dense Arrays

Ultra-small high‐temperature pressure sensor chips fabricated in single‐layer (111) SOI wafers

Flexible pressure/temperature sensors with heterogeneous integration of ultra-thin silicon and polymer

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