Ultra-precision dicing and wire sawing of silicon carbide (SiC)

Cvetković, Srecko; Morsbach, C.; Rissing, Lutz

doi:10.1016/j.mee.2011.02.026

Cited by 38 publications

(15 citation statements)

References 4 publications

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“…The ceramics feature similar grain sizes averaging from 4 to 6 μm. The preliminary results showed a very good form accuracy and lower blade wear by dicing the SSiC, which together with very good mechanical properties postponed SiC as an optimal choice for an embossing tool material [6].…”

Section: Introductionmentioning

confidence: 90%

Embossing of Soft-Magnetic Structures and Influence on Magnetic Properties

et al. 2013

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Magnetic flux guides are often a part of MEMS. These flux guides are usually made by electroplating of soft magnetic materials like NiFe. The geometry of the flux guides influences the magnetic anisotropy. A new method for the fabrication of the flux guides is the embossing of the surface to influence the magnetic anisotropy. For this purpose the Institute for micro production technology (IMPT) at the Leibniz Universitaet Hannover designed and fabricated two tools for a molding press. The embossing tool for a molding press (silicon carbide) and a bond tool are applied. This contribution describes the fabrication of the embossing tools for the molding press and the embossing process of NiFe45/55 surfaces applying the fabricated tools and the wire bond tool. The embossed surfaces are characterized via a Kerr microscope.

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Section: Introductionmentioning

confidence: 90%

Embossing of Soft-Magnetic Structures and Influence on Magnetic Properties

et al. 2013

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“…Luo et al [16] explored the edge chipping mechanism through studying the relationship between sawing direction, crystal direction and chip size during cutting of monocrystalline silicon with diamond saw blade. Moreover, Cvetkovic et al [17] found that the ultra-precision cutting with the saw blade has many unique advantages for suppressing edge chipping and reducing sidewall roughness compared to wire sawing, but it is easy to cause greater sidewall curvature.…”

Section: Introductionmentioning

confidence: 99%

Investigation on the Edge Chipping in Ultrasonic Assisted Sawing of Monocrystalline Silicon

et al. 2019

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Monocrystalline silicon is an important semiconductor material and occupies a large part of the market demand. However, as a hard-brittle material, monocrystalline silicon is extremely prone to happen edge chipping during sawing processing. The edge chipping seriously affects the quality and performance of silicon wafers. In this paper, both conventional and ultrasonicassisted sawing tests were carried out on monocrystalline silicon to study the formation mechanism of edge chipping. The shape and size of edge chipping after sawing process were observed and measured. The experimental results demonstrated that different sawing processes present different material removal modes and edge quality. The mode of crack propagation was continuous cracks in conventional sawing process, while the expansion mode in ultrasonic assisted sawing was blasting microcracks. This results in the cutting force of ultrasonic assisted sawing becomes much smaller than that of conventional sawing process, which can reduce the size of edge chipping and improve the quality of machined surface.

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“…6–9 Besides laser cutting and electrochemical micromachining, mechanical precision machining with dicing blades is well suited for fabrication of complex microstructures and miniature components/parts while with enhanced functionality. 10–12 As one of the most common methods for cutting hard-brittle thin wafers, bladed dicing is characterized using abrasive thin blades as the cutting element. 13,14 The dicing blade is fixed on a high-speed spindle normally supported by aerostatic or ceramic bearings.…”

Section: Introductionmentioning

confidence: 99%

Investigation on the fabrication of dicing blades with different sintering methods for machining hard-brittle material wafers

Yuan

Cheng

Zhang

et al. 2018

Proceedings of the Institution of Mechanical Engineers, Part B:

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Hard-brittle materials applied in various micro-electromechanical systems should be sliced into miniature and microparts often with complex microstructures. However, it is difficult for bladed dicing to machine those materials without damage because of their hard and brittle properties. This article presents innovative design and fabrication of dicing blades and the associated dicing process optimization, particularly by focusing on the blade wheel fabrication through sintering methods including traditional hot press sintering, vacuum sintering and spark plasma sintering. Four key parameters, namely, the radial wear of the dicing blade, the current of relay, the number of chips larger than 50 μm and the largest chip size, are employed to assess the cutting performance of dicing blades fabricated. The analysis and experimental results indicate that the spark plasma sintering method achieves the lowest number of chips and the smallest chip size due to its rapid spark between metal particles during the sintering process. The spark plasma sintering method can also produce a granular microstructure with sufficient porosities, which results in uniform bonding strength of diamond abrasive grits within the dicing blade. For the dicing process parameters, the back cutting depth has the most obvious influence on the dicing blade tool life, cutting current and slicing damages, while the feed rate is ranked the next. The least influencing parameter is the dicing spindle rotational speed.

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Ultra-precision dicing and wire sawing of silicon carbide (SiC)

Cited by 38 publications

References 4 publications

Embossing of Soft-Magnetic Structures and Influence on Magnetic Properties

Embossing of Soft-Magnetic Structures and Influence on Magnetic Properties

Investigation on the Edge Chipping in Ultrasonic Assisted Sawing of Monocrystalline Silicon

Investigation on the fabrication of dicing blades with different sintering methods for machining hard-brittle material wafers

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